STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES AND MODULES

In a general aspect, an apparatus can include a first substrate operatively coupled with a second substrate. The apparatus can also include a power supply terminal assembly including a first power supply terminal aligned along a first plane, the first power supply terminal being electrically coupled...

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Hauptverfasser: Im, Seungwon, Lee, ByoungOk, Jong, Mankyo, Son, Joonseo, Jeon, Oseob
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Sprache:eng ; fre ; ger
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creator Im, Seungwon
Lee, ByoungOk
Jong, Mankyo
Son, Joonseo
Jeon, Oseob
description In a general aspect, an apparatus can include a first substrate operatively coupled with a second substrate. The apparatus can also include a power supply terminal assembly including a first power supply terminal aligned along a first plane, the first power supply terminal being electrically coupled with the first substrate. The power supply terminal assembly can also include a second power supply terminal aligned along a second plane, the second power supply terminal being electrically coupled with the second substrate. The power supply terminal assembly can further include a power supply terminal frame having an isolation portion disposed between the first power supply terminal and the second power supply terminal and a retention portion disposed around a portion of the first power supply terminal and disposed around a portion of the second power supply terminal.
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subjects APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS
BASIC ELECTRIC ELEMENTS
CONTROL OR REGULATION THEREOF
CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
LINE CONNECTORS
SEMICONDUCTOR DEVICES
title STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES AND MODULES
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