ELECTRONIC ASSEMBLY WITH ENHANCED THERMAL DISSIPATION THANKS TO A METALLIC BONDING LAYER COMPOSED OF SOLDER AND COPPER

An electronic assembly (111, 211, 311) comprises a semiconductor device (14) with a first side (42) and a second side (44) opposite the first side (42). The first side (42) has a first conductive pad (34). The second side (44) has a primary metallic surface (22, 122). A first substrate (e.g. lead fr...

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Bibliographische Detailangaben

Hauptverfasser:	SINGH, Brij N, ZURN, Michael J, KINYANJUI, Robert K, ROAN, Thomas J, PALMER, Brad G
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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