EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE
A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electricall...
Gespeichert in:
| Hauptverfasser: | , , , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | WOODS, Jason FRUSTACI, Dominick J BRENDEL, Richard L FRYSZ, Christine A SEITZ, Keith W THIEBOLT, William C STEVENSON, Robert A MARZANO, Thomas WINN, Steven W TANG, Xiaohong |
| description | A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3366348A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3366348A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3366348A13</originalsourceid><addsrcrecordid>eNqNjTEKwkAQRdNYiHqHOYAWEhHbyeyPO7CbhHWNWAWRtRINxCN4cEUsLK0ej_fhj7MnvFKpLiLAkNQLqasKEt9iETyiCpWAiTbU-62d_woJNywa60BcGXJgc9AA4t0OvnBHKj-FWKK2IPWN4ypy4UAeRoUdGbQqmGajy-k6pNmXk-x9E8UuUn_v0tCfzumWHh2aPF-v89WGl_kfkxehwzxo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE</title><source>esp@cenet</source><creator>WOODS, Jason ; FRUSTACI, Dominick J ; BRENDEL, Richard L ; FRYSZ, Christine A ; SEITZ, Keith W ; THIEBOLT, William C ; STEVENSON, Robert A ; MARZANO, Thomas ; WINN, Steven W ; TANG, Xiaohong</creator><creatorcontrib>WOODS, Jason ; FRUSTACI, Dominick J ; BRENDEL, Richard L ; FRYSZ, Christine A ; SEITZ, Keith W ; THIEBOLT, William C ; STEVENSON, Robert A ; MARZANO, Thomas ; WINN, Steven W ; TANG, Xiaohong</creatorcontrib><description>A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CASTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROTHERAPY ; HUMAN NECESSITIES ; HYGIENE ; MAGNETOTHERAPY ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEDICAL OR VETERINARY SCIENCE ; PERFORMING OPERATIONS ; POWDER METALLURGY ; PRINTED CIRCUITS ; RADIATION THERAPY ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; ULTRASOUND THERAPY ; WORKING METALLIC POWDER</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180829&DB=EPODOC&CC=EP&NR=3366348A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180829&DB=EPODOC&CC=EP&NR=3366348A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WOODS, Jason</creatorcontrib><creatorcontrib>FRUSTACI, Dominick J</creatorcontrib><creatorcontrib>BRENDEL, Richard L</creatorcontrib><creatorcontrib>FRYSZ, Christine A</creatorcontrib><creatorcontrib>SEITZ, Keith W</creatorcontrib><creatorcontrib>THIEBOLT, William C</creatorcontrib><creatorcontrib>STEVENSON, Robert A</creatorcontrib><creatorcontrib>MARZANO, Thomas</creatorcontrib><creatorcontrib>WINN, Steven W</creatorcontrib><creatorcontrib>TANG, Xiaohong</creatorcontrib><title>EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE</title><description>A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CASTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROTHERAPY</subject><subject>HUMAN NECESSITIES</subject><subject>HYGIENE</subject><subject>MAGNETOTHERAPY</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEDICAL OR VETERINARY SCIENCE</subject><subject>PERFORMING OPERATIONS</subject><subject>POWDER METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>RADIATION THERAPY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>ULTRASOUND THERAPY</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjTEKwkAQRdNYiHqHOYAWEhHbyeyPO7CbhHWNWAWRtRINxCN4cEUsLK0ej_fhj7MnvFKpLiLAkNQLqasKEt9iETyiCpWAiTbU-62d_woJNywa60BcGXJgc9AA4t0OvnBHKj-FWKK2IPWN4ypy4UAeRoUdGbQqmGajy-k6pNmXk-x9E8UuUn_v0tCfzumWHh2aPF-v89WGl_kfkxehwzxo</recordid><startdate>20180829</startdate><enddate>20180829</enddate><creator>WOODS, Jason</creator><creator>FRUSTACI, Dominick J</creator><creator>BRENDEL, Richard L</creator><creator>FRYSZ, Christine A</creator><creator>SEITZ, Keith W</creator><creator>THIEBOLT, William C</creator><creator>STEVENSON, Robert A</creator><creator>MARZANO, Thomas</creator><creator>WINN, Steven W</creator><creator>TANG, Xiaohong</creator><scope>EVB</scope></search><sort><creationdate>20180829</creationdate><title>EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE</title><author>WOODS, Jason ; FRUSTACI, Dominick J ; BRENDEL, Richard L ; FRYSZ, Christine A ; SEITZ, Keith W ; THIEBOLT, William C ; STEVENSON, Robert A ; MARZANO, Thomas ; WINN, Steven W ; TANG, Xiaohong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3366348A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CASTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROTHERAPY</topic><topic>HUMAN NECESSITIES</topic><topic>HYGIENE</topic><topic>MAGNETOTHERAPY</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEDICAL OR VETERINARY SCIENCE</topic><topic>PERFORMING OPERATIONS</topic><topic>POWDER METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>RADIATION THERAPY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>ULTRASOUND THERAPY</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>WOODS, Jason</creatorcontrib><creatorcontrib>FRUSTACI, Dominick J</creatorcontrib><creatorcontrib>BRENDEL, Richard L</creatorcontrib><creatorcontrib>FRYSZ, Christine A</creatorcontrib><creatorcontrib>SEITZ, Keith W</creatorcontrib><creatorcontrib>THIEBOLT, William C</creatorcontrib><creatorcontrib>STEVENSON, Robert A</creatorcontrib><creatorcontrib>MARZANO, Thomas</creatorcontrib><creatorcontrib>WINN, Steven W</creatorcontrib><creatorcontrib>TANG, Xiaohong</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WOODS, Jason</au><au>FRUSTACI, Dominick J</au><au>BRENDEL, Richard L</au><au>FRYSZ, Christine A</au><au>SEITZ, Keith W</au><au>THIEBOLT, William C</au><au>STEVENSON, Robert A</au><au>MARZANO, Thomas</au><au>WINN, Steven W</au><au>TANG, Xiaohong</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE</title><date>2018-08-29</date><risdate>2018</risdate><abstract>A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP3366348A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROTHERAPY HUMAN NECESSITIES HYGIENE MAGNETOTHERAPY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEDICAL OR VETERINARY SCIENCE PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS RADIATION THERAPY SEMICONDUCTOR DEVICES TRANSPORTING ULTRASOUND THERAPY WORKING METALLIC POWDER |
| title | EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T09%3A45%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WOODS,%20Jason&rft.date=2018-08-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3366348A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |