METHOD OF MANUFACTURING AN RFID TAG ASSEMBLY AND RFID TAG ASSEMBLY

A method of manufacturing an RFID tag assembly, the method comprising: providing a mounting base made of an electrically conductive material; providing a passive mount-on-metal RFID tag, the RFID tag comprising an IC chip and an antenna provided on one side; mounting the RFID tag on the mounting base with said one side of the RFID tag coupled to the mounting base, to form an RFID tag-mounting base sub-assembly; providing a mold tool comprising a mold cavity shaped to form a cover of the RFID tag assembly and locating the RFID tag-mounting base sub-assembly within the mold cavity; and delivering a substantially RF transparent material in a molten state into the void between the mold tool and the RFID tag-mounting base sub-assembly and allowing the material to cool into a solid state to form a cover over the RFID tag-mounting base sub-assembly, such that the mounting base and the cover together encapsulate the RFID tag. The substantially RF transparent material has a temperature in the molten state on delivery into the void that is higher than a maximum tolerable temperature of the IC chip and the molten material is delivered into the void at a position removed from IC chip. The IC chip position such that the temperature of the molten material does not exceed the maximum tolerable temperature of the IC chip when the substantially RF transparent material reaches the IC chip.