METAL PASTE AND THERMOELECTRIC MODULE

The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which ad...

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Hauptverfasser: LEE, Dae Ki, PARK, Cheol-Hee, KIM, Dong-Sik
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Sprache:eng ; fre ; ger
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creator LEE, Dae Ki
PARK, Cheol-Hee
KIM, Dong-Sik
description The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3349262A4</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3349262A4</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3349262A43</originalsourceid><addsrcrecordid>eNrjZFD1dQ1x9FEIcAwOcVVw9HNRCPFwDfL1d_VxdQ4J8nRW8PV3CfVx5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxsYmlkZmRo4mxkQoAQBTviLX</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METAL PASTE AND THERMOELECTRIC MODULE</title><source>esp@cenet</source><creator>LEE, Dae Ki ; PARK, Cheol-Hee ; KIM, Dong-Sik</creator><creatorcontrib>LEE, Dae Ki ; PARK, Cheol-Hee ; KIM, Dong-Sik</creatorcontrib><description>The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CONDUCTORS ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRICITY ; INSULATORS ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181031&amp;DB=EPODOC&amp;CC=EP&amp;NR=3349262A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181031&amp;DB=EPODOC&amp;CC=EP&amp;NR=3349262A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE, Dae Ki</creatorcontrib><creatorcontrib>PARK, Cheol-Hee</creatorcontrib><creatorcontrib>KIM, Dong-Sik</creatorcontrib><title>METAL PASTE AND THERMOELECTRIC MODULE</title><description>The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CONDUCTORS</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD1dQ1x9FEIcAwOcVVw9HNRCPFwDfL1d_VxdQ4J8nRW8PV3CfVx5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxsYmlkZmRo4mxkQoAQBTviLX</recordid><startdate>20181031</startdate><enddate>20181031</enddate><creator>LEE, Dae Ki</creator><creator>PARK, Cheol-Hee</creator><creator>KIM, Dong-Sik</creator><scope>EVB</scope></search><sort><creationdate>20181031</creationdate><title>METAL PASTE AND THERMOELECTRIC MODULE</title><author>LEE, Dae Ki ; PARK, Cheol-Hee ; KIM, Dong-Sik</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3349262A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CONDUCTORS</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, Dae Ki</creatorcontrib><creatorcontrib>PARK, Cheol-Hee</creatorcontrib><creatorcontrib>KIM, Dong-Sik</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, Dae Ki</au><au>PARK, Cheol-Hee</au><au>KIM, Dong-Sik</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METAL PASTE AND THERMOELECTRIC MODULE</title><date>2018-10-31</date><risdate>2018</risdate><abstract>The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.</abstract><oa>free_for_read</oa></addata></record>
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language eng ; fre ; ger
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subjects BASIC ELECTRIC ELEMENTS
CABLES
CLADDING OR PLATING BY SOLDERING OR WELDING
CONDUCTORS
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRICITY
INSULATORS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title METAL PASTE AND THERMOELECTRIC MODULE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T02%3A40%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LEE,%20Dae%20Ki&rft.date=2018-10-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3349262A4%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true