ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING HOUSING OF SAME
An electronic device, according to various embodiments of the present disclosure, may comprise: a housing comprising a first plate facing a first direction, a second plate facing a second direction opposite the first direction, and a side member having a first thickness in a third direction perpendi...
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| creator | LEE, Dong-Ik KIM, Ji-Hoon KIM, Ki-Jae SEO, Jae-Il |
| description | An electronic device, according to various embodiments of the present disclosure, may comprise: a housing comprising a first plate facing a first direction, a second plate facing a second direction opposite the first direction, and a side member having a first thickness in a third direction perpendicular to the first direction, while at least partially enclosing a space between the first plate and the second plate; a display disposed between the first plate and the second plate within the housing; a printed circuit board disposed between the display and the second plate within the housing; and an inner structure disposed between the printed circuit board and the second plate within the housing while having a second thickness in the first direction, wherein the inner structure may comprise a flat portion extending from the side member and made of the same metal material as the side member, and wherein the maximum value of the first thickness may be greater than the maximum value of the second thickness. The electronic device as above may vary according to the embodiments. |
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The electronic device as above may vary according to the embodiments.</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONTROL OR REGULATING SYSTEMS IN GENERAL ; CONTROLLING ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS ; PHYSICS ; PRINTED CIRCUITS ; REGULATING ; TELEPHONIC COMMUNICATION</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241106&DB=EPODOC&CC=EP&NR=3343885B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241106&DB=EPODOC&CC=EP&NR=3343885B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE, Dong-Ik</creatorcontrib><creatorcontrib>KIM, Ji-Hoon</creatorcontrib><creatorcontrib>KIM, Ki-Jae</creatorcontrib><creatorcontrib>SEO, Jae-Il</creatorcontrib><title>ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING HOUSING OF SAME</title><description>An electronic device, according to various embodiments of the present disclosure, may comprise: a housing comprising a first plate facing a first direction, a second plate facing a second direction opposite the first direction, and a side member having a first thickness in a third direction perpendicular to the first direction, while at least partially enclosing a space between the first plate and the second plate; a display disposed between the first plate and the second plate within the housing; a printed circuit board disposed between the display and the second plate within the housing; and an inner structure disposed between the printed circuit board and the second plate within the housing while having a second thickness in the first direction, wherein the inner structure may comprise a flat portion extending from the side member and made of the same metal material as the side member, and wherein the maximum value of the first thickness may be greater than the maximum value of the second thickness. The electronic device as above may vary according to the embodiments.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONTROL OR REGULATING SYSTEMS IN GENERAL</subject><subject>CONTROLLING</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FUNCTIONAL ELEMENTS OF SUCH SYSTEMS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>REGULATING</subject><subject>TELEPHONIC COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBz9XF1Dgny9_N0VnBxDfN0dlVw9HNR8HUN8fB3UXDzD1LwdfQLdXN0DgkN8vRzV_DwDw0G0f5uCsGOvq48DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSTeNcDY2MTYwsLUydCYCCUA8T8pkg</recordid><startdate>20241106</startdate><enddate>20241106</enddate><creator>LEE, Dong-Ik</creator><creator>KIM, Ji-Hoon</creator><creator>KIM, Ki-Jae</creator><creator>SEO, Jae-Il</creator><scope>EVB</scope></search><sort><creationdate>20241106</creationdate><title>ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING HOUSING OF SAME</title><author>LEE, Dong-Ik ; KIM, Ji-Hoon ; KIM, Ki-Jae ; SEO, Jae-Il</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3343885B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONTROL OR REGULATING SYSTEMS IN GENERAL</topic><topic>CONTROLLING</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FUNCTIONAL ELEMENTS OF SUCH SYSTEMS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>REGULATING</topic><topic>TELEPHONIC COMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, Dong-Ik</creatorcontrib><creatorcontrib>KIM, Ji-Hoon</creatorcontrib><creatorcontrib>KIM, Ki-Jae</creatorcontrib><creatorcontrib>SEO, Jae-Il</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, Dong-Ik</au><au>KIM, Ji-Hoon</au><au>KIM, Ki-Jae</au><au>SEO, Jae-Il</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING HOUSING OF SAME</title><date>2024-11-06</date><risdate>2024</risdate><abstract>An electronic device, according to various embodiments of the present disclosure, may comprise: a housing comprising a first plate facing a first direction, a second plate facing a second direction opposite the first direction, and a side member having a first thickness in a third direction perpendicular to the first direction, while at least partially enclosing a space between the first plate and the second plate; a display disposed between the first plate and the second plate within the housing; a printed circuit board disposed between the display and the second plate within the housing; and an inner structure disposed between the printed circuit board and the second plate within the housing while having a second thickness in the first direction, wherein the inner structure may comprise a flat portion extending from the side member and made of the same metal material as the side member, and wherein the maximum value of the first thickness may be greater than the maximum value of the second thickness. The electronic device as above may vary according to the embodiments.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PHYSICS PRINTED CIRCUITS REGULATING TELEPHONIC COMMUNICATION |
| title | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING HOUSING OF SAME |
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