POLISHING PAD AND POLISHING METHOD
To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to...
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| creator | MORINAGA, Hitoshi TAMAI, Kazusei ITO, Yuuichi TAHARA, Muneaki ASAI, Maiko |
| description | To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m 2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface. |
| format | Patent |
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The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m 2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface.</description><language>eng ; fre ; ger</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180829&DB=EPODOC&CC=EP&NR=3326751A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180829&DB=EPODOC&CC=EP&NR=3326751A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORINAGA, Hitoshi</creatorcontrib><creatorcontrib>TAMAI, Kazusei</creatorcontrib><creatorcontrib>ITO, Yuuichi</creatorcontrib><creatorcontrib>TAHARA, Muneaki</creatorcontrib><creatorcontrib>ASAI, Maiko</creatorcontrib><title>POLISHING PAD AND POLISHING METHOD</title><description>To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m 2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface.</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAK8PfxDPbw9HNXCHB0UXD0c1FAiPi6hnj4u_AwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknjXAGNjIzNzU0NHE2MilAAA6fsh8A</recordid><startdate>20180829</startdate><enddate>20180829</enddate><creator>MORINAGA, Hitoshi</creator><creator>TAMAI, Kazusei</creator><creator>ITO, Yuuichi</creator><creator>TAHARA, Muneaki</creator><creator>ASAI, Maiko</creator><scope>EVB</scope></search><sort><creationdate>20180829</creationdate><title>POLISHING PAD AND POLISHING METHOD</title><author>MORINAGA, Hitoshi ; TAMAI, Kazusei ; ITO, Yuuichi ; TAHARA, Muneaki ; ASAI, Maiko</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3326751A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MORINAGA, Hitoshi</creatorcontrib><creatorcontrib>TAMAI, Kazusei</creatorcontrib><creatorcontrib>ITO, Yuuichi</creatorcontrib><creatorcontrib>TAHARA, Muneaki</creatorcontrib><creatorcontrib>ASAI, Maiko</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MORINAGA, Hitoshi</au><au>TAMAI, Kazusei</au><au>ITO, Yuuichi</au><au>TAHARA, Muneaki</au><au>ASAI, Maiko</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING PAD AND POLISHING METHOD</title><date>2018-08-29</date><risdate>2018</risdate><abstract>To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m 2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| source | esp@cenet |
| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
| title | POLISHING PAD AND POLISHING METHOD |
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