COMPONENT WITH IMPROVED HEAT DISSIPATION

COMPONENT WITH IMPROVED HEAT DISSIPATION

In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient αLS, which is substantially higher than the first...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JEWULA, Tomasz, MEISTER, Veit
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator JEWULA, Tomasz
MEISTER, Veit
description In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient αLS, which is substantially higher than the first thermal conductivity coefficient αS of the substrate. The heat dissipation then succeeds via the heat-conducting means and via connecting means which connect the substrate to a carrier.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3323200B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3323200B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3323200B13</originalsourceid><addsrcrecordid>eNrjZNBw9vcN8Pdz9QtRCPcM8VDw9A0I8g9zdVHwcHUMUXDxDA72DHAM8fT342FgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxsZGxkYGBk6GxkQoAQDZkCPR</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COMPONENT WITH IMPROVED HEAT DISSIPATION</title><source>esp@cenet</source><creator>JEWULA, Tomasz ; MEISTER, Veit</creator><creatorcontrib>JEWULA, Tomasz ; MEISTER, Veit</creatorcontrib><description>In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient αLS, which is substantially higher than the first thermal conductivity coefficient αS of the substrate. The heat dissipation then succeeds via the heat-conducting means and via connecting means which connect the substrate to a carrier.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRONIC CIRCUITRY ; ELECTRICITY ; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS ; RESONATORS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200812&amp;DB=EPODOC&amp;CC=EP&amp;NR=3323200B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200812&amp;DB=EPODOC&amp;CC=EP&amp;NR=3323200B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JEWULA, Tomasz</creatorcontrib><creatorcontrib>MEISTER, Veit</creatorcontrib><title>COMPONENT WITH IMPROVED HEAT DISSIPATION</title><description>In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient αLS, which is substantially higher than the first thermal conductivity coefficient αS of the substrate. The heat dissipation then succeeds via the heat-conducting means and via connecting means which connect the substrate to a carrier.</description><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>ELECTRICITY</subject><subject>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</subject><subject>RESONATORS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBw9vcN8Pdz9QtRCPcM8VDw9A0I8g9zdVHwcHUMUXDxDA72DHAM8fT342FgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxsZGxkYGBk6GxkQoAQDZkCPR</recordid><startdate>20200812</startdate><enddate>20200812</enddate><creator>JEWULA, Tomasz</creator><creator>MEISTER, Veit</creator><scope>EVB</scope></search><sort><creationdate>20200812</creationdate><title>COMPONENT WITH IMPROVED HEAT DISSIPATION</title><author>JEWULA, Tomasz ; MEISTER, Veit</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3323200B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2020</creationdate><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>ELECTRICITY</topic><topic>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</topic><topic>RESONATORS</topic><toplevel>online_resources</toplevel><creatorcontrib>JEWULA, Tomasz</creatorcontrib><creatorcontrib>MEISTER, Veit</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JEWULA, Tomasz</au><au>MEISTER, Veit</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPONENT WITH IMPROVED HEAT DISSIPATION</title><date>2020-08-12</date><risdate>2020</risdate><abstract>In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient αLS, which is substantially higher than the first thermal conductivity coefficient αS of the substrate. The heat dissipation then succeeds via the heat-conducting means and via connecting means which connect the substrate to a carrier.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP3323200B1
source esp@cenet
subjects BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
title COMPONENT WITH IMPROVED HEAT DISSIPATION
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T19%3A05%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JEWULA,%20Tomasz&rft.date=2020-08-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3323200B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true