BRAZING PROCESS INVOLVING SINTERING A CONDUCTIVE POWDER BY ULTRASONIC THERMOCOMPRESSION AND ELECTRONIC POWER MODULE PRODUCED BY THIS PROCESS

This soldering process, which uses a filler material and is intended to bond a semiconductor chip (1) to a substrate (2), is of the type wherein an assembly block (1-2-3) comprising the substrate (2), a layer (3) of conductive powder deposited on the substrate (2), and the semiconductor chip (1) is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAN, Ky Lim, MORELLE, Jean-Michel
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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