HIGH FREQUENCY MODULE

HIGH FREQUENCY MODULE

[Object] To provide a high-frequency module that has a simple structure and that contributes to size reduction of a device. [Solution] A high-frequency module 100 includes a wiring substrate 10 and an antenna substrate 20 disposed on an upper surface of the wiring substrate 10, an antenna 21 is form...

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Hauptverfasser: NAKAGAWA, Masashi, SHIBUYA, Yoshihisa, KUWANA, Shunji, WATANABE, Hideki, SEIKE, Takehiro
Format: Patent
Sprache:eng ; fre ; ger
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator NAKAGAWA, Masashi
SHIBUYA, Yoshihisa
KUWANA, Shunji
WATANABE, Hideki
SEIKE, Takehiro
description [Object] To provide a high-frequency module that has a simple structure and that contributes to size reduction of a device. [Solution] A high-frequency module 100 includes a wiring substrate 10 and an antenna substrate 20 disposed on an upper surface of the wiring substrate 10, an antenna 21 is formed by a metal pattern 21a on the antenna substrate 20, a non-conductive adhesive 11 and a conductive adhesive 13 are present between the wiring substrate 10 and the antenna substrate 20, and a spacer 23 is provided between the non-conductive adhesive 11 and the conductive adhesive 13. Thus, by the spacer 23, it is possible to prevent contact between the non-conductive adhesive 11 and the conductive adhesive 13 and it is also possible to ensure a required height between the wiring substrate 10 and the antenna substrate 20. In addition, it is possible to achieve connection between the wiring substrate 10 and the antenna substrate 20 by a simple structure.
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[Solution] A high-frequency module 100 includes a wiring substrate 10 and an antenna substrate 20 disposed on an upper surface of the wiring substrate 10, an antenna 21 is formed by a metal pattern 21a on the antenna substrate 20, a non-conductive adhesive 11 and a conductive adhesive 13 are present between the wiring substrate 10 and the antenna substrate 20, and a spacer 23 is provided between the non-conductive adhesive 11 and the conductive adhesive 13. Thus, by the spacer 23, it is possible to prevent contact between the non-conductive adhesive 11 and the conductive adhesive 13 and it is also possible to ensure a required height between the wiring substrate 10 and the antenna substrate 20. 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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title HIGH FREQUENCY MODULE
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