HIGH FREQUENCY MODULE

[Object] To provide a high-frequency module that has a simple structure and that contributes to size reduction of a device. [Solution] A high-frequency module 100 includes a wiring substrate 10 and an antenna substrate 20 disposed on an upper surface of the wiring substrate 10, an antenna 21 is form...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKAGAWA, Masashi, SHIBUYA, Yoshihisa, KUWANA, Shunji, WATANABE, Hideki, SEIKE, Takehiro
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:[Object] To provide a high-frequency module that has a simple structure and that contributes to size reduction of a device. [Solution] A high-frequency module 100 includes a wiring substrate 10 and an antenna substrate 20 disposed on an upper surface of the wiring substrate 10, an antenna 21 is formed by a metal pattern 21a on the antenna substrate 20, a non-conductive adhesive 11 and a conductive adhesive 13 are present between the wiring substrate 10 and the antenna substrate 20, and a spacer 23 is provided between the non-conductive adhesive 11 and the conductive adhesive 13. Thus, by the spacer 23, it is possible to prevent contact between the non-conductive adhesive 11 and the conductive adhesive 13 and it is also possible to ensure a required height between the wiring substrate 10 and the antenna substrate 20. In addition, it is possible to achieve connection between the wiring substrate 10 and the antenna substrate 20 by a simple structure.