LED FABRICATION USING HIGH-REFRACTIVE-INDEX ADHESIVES

Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contamina...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	VAN LETH, Nicolaas Joseph Martin, SCHRICKER, April Dawn, ROITMAN, Daniel
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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