HEAT MOLDING DEVICE AND HEAT MOLDING METHOD

A thermoforming device includes: a base configured to hold a substrate; a hot plate including a heating surface facing vertically downward; a sheet transport portion that supplies a sheet onto the heating surface of the hot plate; and a substrate supply portion configured to attach the substrate to...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TERAMOTO, Kazunori
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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