HIGH THERMAL CONDUCTIVITY WAFER SUPPORT PEDESTAL DEVICE

A support pedestal device for an electrostatic chuck includes a base housing defining an internal cavity, and a base insert disposed proximate the internal cavity of the base housing. A fluid pathway is formed in the internal cavity and includes a plurality of linear-parallel cooling channels separa...

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Hauptverfasser: AMES, Ken, ATLAS, Boris, SMITH, Kevin, R, PTASIENSKI, Kevin, NOSRATI, Mohammad
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Sprache:eng ; fre ; ger
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creator AMES, Ken
ATLAS, Boris
SMITH, Kevin, R
PTASIENSKI, Kevin
NOSRATI, Mohammad
description A support pedestal device for an electrostatic chuck includes a base housing defining an internal cavity, and a base insert disposed proximate the internal cavity of the base housing. A fluid pathway is formed in the internal cavity and includes a plurality of linear-parallel cooling channels separated by corresponding plurality of linear-parallel cooling fins, a fluid supply channel, and a fluid return channel. A cooling fluid flows through the fluid supply channel, through the plurality of linear-parallel cooling channels, and back through the fluid return channel to cool the support pedestal device.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title HIGH THERMAL CONDUCTIVITY WAFER SUPPORT PEDESTAL DEVICE
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