METHODS AND SYSTEMS FOR BONDING
Methods and apparatus are described for improving fit checking at the bonding interface of a first component, such as a fan blade (1), and a second component, such as an edge guard (2) for the fan blade (1), to be bonded by adhesive. A bondline thickness profile over the area of the bonding interfac...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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