METHODS AND SYSTEMS FOR BONDING

Methods and apparatus are described for improving fit checking at the bonding interface of a first component, such as a fan blade (1), and a second component, such as an edge guard (2) for the fan blade (1), to be bonded by adhesive. A bondline thickness profile over the area of the bonding interfac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: COLLIS, Andrew, RICHMOND, Nolan
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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