PRESSURE SENSOR MODULE
A pressure sensor module (10) comprises a base electrode (14) surrounding at least a part of a bottom electrode (15), and an anchor arrangement (20) on top of the base electrode (14) comprising at least two electrically conductive walls (19) that both surround at least a part of the bottom electrode...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Daamen, Roel Bouman, Hendrik Pijnenburg, Remco Henricus Wilhelmus van Lippen, Twan Vijayakumar, Kailash |
description | A pressure sensor module (10) comprises a base electrode (14) surrounding at least a part of a bottom electrode (15), and an anchor arrangement (20) on top of the base electrode (14) comprising at least two electrically conductive walls (19) that both surround at least a part of the bottom electrode (15). The pressure sensor module (10) further comprises an electrically conductive layer (18) that covers at least the bottom electrode (15) and the anchor arrangement (20) such that a cavity (17) is formed between the bottom electrode (15), the anchor arrangement (20) and the electrically conductive layer (18). The proportionate area of the electrically conductive walls (19) in a cross section extending from the surface (32) of the inner wall of the anchor arrangement (20) facing the cavity (17) to the surface (33) of the outermost wall of the anchor arrangement (20) facing away from the cavity (17) in a plane parallel to the plane of the bottom electrode (15) is equal to or less than 10 %. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3279630A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3279630A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3279630A13</originalsourceid><addsrcrecordid>eNrjZBALCHINDg4NclUIdvUL9g9S8PV3CfVx5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxkbmlmbGBo6GxkQoAQCP6B76</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PRESSURE SENSOR MODULE</title><source>esp@cenet</source><creator>Daamen, Roel ; Bouman, Hendrik ; Pijnenburg, Remco Henricus Wilhelmus ; van Lippen, Twan ; Vijayakumar, Kailash</creator><creatorcontrib>Daamen, Roel ; Bouman, Hendrik ; Pijnenburg, Remco Henricus Wilhelmus ; van Lippen, Twan ; Vijayakumar, Kailash</creatorcontrib><description>A pressure sensor module (10) comprises a base electrode (14) surrounding at least a part of a bottom electrode (15), and an anchor arrangement (20) on top of the base electrode (14) comprising at least two electrically conductive walls (19) that both surround at least a part of the bottom electrode (15). The pressure sensor module (10) further comprises an electrically conductive layer (18) that covers at least the bottom electrode (15) and the anchor arrangement (20) such that a cavity (17) is formed between the bottom electrode (15), the anchor arrangement (20) and the electrically conductive layer (18). The proportionate area of the electrically conductive walls (19) in a cross section extending from the surface (32) of the inner wall of the anchor arrangement (20) facing the cavity (17) to the surface (33) of the outermost wall of the anchor arrangement (20) facing away from the cavity (17) in a plane parallel to the plane of the bottom electrode (15) is equal to or less than 10 %.</description><language>eng ; fre ; ger</language><subject>MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PHYSICS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; TESTING ; TRANSPORTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180207&DB=EPODOC&CC=EP&NR=3279630A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180207&DB=EPODOC&CC=EP&NR=3279630A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Daamen, Roel</creatorcontrib><creatorcontrib>Bouman, Hendrik</creatorcontrib><creatorcontrib>Pijnenburg, Remco Henricus Wilhelmus</creatorcontrib><creatorcontrib>van Lippen, Twan</creatorcontrib><creatorcontrib>Vijayakumar, Kailash</creatorcontrib><title>PRESSURE SENSOR MODULE</title><description>A pressure sensor module (10) comprises a base electrode (14) surrounding at least a part of a bottom electrode (15), and an anchor arrangement (20) on top of the base electrode (14) comprising at least two electrically conductive walls (19) that both surround at least a part of the bottom electrode (15). The pressure sensor module (10) further comprises an electrically conductive layer (18) that covers at least the bottom electrode (15) and the anchor arrangement (20) such that a cavity (17) is formed between the bottom electrode (15), the anchor arrangement (20) and the electrically conductive layer (18). The proportionate area of the electrically conductive walls (19) in a cross section extending from the surface (32) of the inner wall of the anchor arrangement (20) facing the cavity (17) to the surface (33) of the outermost wall of the anchor arrangement (20) facing away from the cavity (17) in a plane parallel to the plane of the bottom electrode (15) is equal to or less than 10 %.</description><subject>MEASURING</subject><subject>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBALCHINDg4NclUIdvUL9g9S8PV3CfVx5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxkbmlmbGBo6GxkQoAQCP6B76</recordid><startdate>20180207</startdate><enddate>20180207</enddate><creator>Daamen, Roel</creator><creator>Bouman, Hendrik</creator><creator>Pijnenburg, Remco Henricus Wilhelmus</creator><creator>van Lippen, Twan</creator><creator>Vijayakumar, Kailash</creator><scope>EVB</scope></search><sort><creationdate>20180207</creationdate><title>PRESSURE SENSOR MODULE</title><author>Daamen, Roel ; Bouman, Hendrik ; Pijnenburg, Remco Henricus Wilhelmus ; van Lippen, Twan ; Vijayakumar, Kailash</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3279630A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>MEASURING</topic><topic>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Daamen, Roel</creatorcontrib><creatorcontrib>Bouman, Hendrik</creatorcontrib><creatorcontrib>Pijnenburg, Remco Henricus Wilhelmus</creatorcontrib><creatorcontrib>van Lippen, Twan</creatorcontrib><creatorcontrib>Vijayakumar, Kailash</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Daamen, Roel</au><au>Bouman, Hendrik</au><au>Pijnenburg, Remco Henricus Wilhelmus</au><au>van Lippen, Twan</au><au>Vijayakumar, Kailash</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRESSURE SENSOR MODULE</title><date>2018-02-07</date><risdate>2018</risdate><abstract>A pressure sensor module (10) comprises a base electrode (14) surrounding at least a part of a bottom electrode (15), and an anchor arrangement (20) on top of the base electrode (14) comprising at least two electrically conductive walls (19) that both surround at least a part of the bottom electrode (15). The pressure sensor module (10) further comprises an electrically conductive layer (18) that covers at least the bottom electrode (15) and the anchor arrangement (20) such that a cavity (17) is formed between the bottom electrode (15), the anchor arrangement (20) and the electrically conductive layer (18). The proportionate area of the electrically conductive walls (19) in a cross section extending from the surface (32) of the inner wall of the anchor arrangement (20) facing the cavity (17) to the surface (33) of the outermost wall of the anchor arrangement (20) facing away from the cavity (17) in a plane parallel to the plane of the bottom electrode (15) is equal to or less than 10 %.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng ; fre ; ger |
recordid | cdi_epo_espacenet_EP3279630A1 |
source | esp@cenet |
subjects | MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TESTING TRANSPORTING |
title | PRESSURE SENSOR MODULE |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T20%3A00%3A05IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Daamen,%20Roel&rft.date=2018-02-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3279630A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |