SILICA-BASED COMPOSITE FINE-PARTICLE DISPERSION, METHOD FOR PRODUCING SAME, AND POLISHING SLURRY INCLUDING SILICA-BASED COMPOSITE FINE-PARTICLE DISPERSION

A subject of this invention is to provide a dispersion liquid of a silica-based composite particle, which can rapidly polish silica film, Si wafer or even hard-to-process material, can concurrently achieve high surface accuracy (less scratches, etc.), and can suitably be used for surface polishing o...

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Hauptverfasser: KASHIWADA, Shingo, KOMATSU, Michio, WAKAMIYA, Yoshinori, INOUE, Kazuaki, NAKAYAMA, Kazuhiro, TAWARAZAKO, Yuji
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creator KASHIWADA, Shingo
KOMATSU, Michio
WAKAMIYA, Yoshinori
INOUE, Kazuaki
NAKAYAMA, Kazuhiro
TAWARAZAKO, Yuji
description A subject of this invention is to provide a dispersion liquid of a silica-based composite particle, which can rapidly polish silica film, Si wafer or even hard-to-process material, can concurrently achieve high surface accuracy (less scratches, etc.), and can suitably be used for surface polishing of semiconductor devices including semiconductor substrate and wiring board, by virtue of its impurity-free nature. The subject is solved by a dispersion liquid of a silica-based composite particle that contains a silica-based composite particle that has a core particle mainly composed of amorphous silica, and bound thereto a ceria particle mainly composed of crystalline ceria, further has a silica film that covers them, and has the features below. The mass ratio of the core particle and the ceria particle falls within a specific range. X-ray diffractometry allows detection of a crystal phase of ceria only. The crystallite size of crystalline ceria on the (111) plane (at around 2¸ = 28°) falls within a specific range. The content rate of Na, etc. is low. The ratio of Si atomic percentage relative to Ce atomic percentage of the silica film falls within a specific range.
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subjects ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOUNDS THEREOF
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
INORGANIC CHEMISTRY
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-METALLIC ELEMENTS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
title SILICA-BASED COMPOSITE FINE-PARTICLE DISPERSION, METHOD FOR PRODUCING SAME, AND POLISHING SLURRY INCLUDING SILICA-BASED COMPOSITE FINE-PARTICLE DISPERSION
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