SMALL FORM-FACTOR PLUGGABLE (SFP) TRANSCEIVERS

In an exemplary embodiment, a device generally includes a housing, an external heat sink, and at least one of a thermal interface material and a thermoelectric module generally between a side of the housing and the external heat sink. At least one spring contact may be coupled to the side of the housing generally between the housing and the at least one of a thermal interface material and a thermoelectric module. The at least one spring contact and the at least one of a thermal interface material and a thermoelectric module may define at least a portion of a thermally-conductive heat path between the housing and the external heat sink. Additionally, or alternatively, the at least one of a thermal interface material and a thermoelectric module may include a thermal interface material having a thermally-conductive and electrically-conductive material wrapped around at least a portion of the thermal interface material, The thermal interface material and the thermally-conductive and electrically-conductive material may define at least a portion of a thermally-conductive heat path between the housing and the external heat sink. The thermally-conductive and electrically-conductive material wrapped around at least a portion of the thermal interface material may be operable for electrically grounding the housing.