DEPOSITION ARRANGEMENT AND METHOD FOR DEPOSITING

A deposition arrangement (1) is provided for depositing a substance (SB) on a substrate surface (ST1) of a substrate (ST). The deposition arrangement comprises a deposition source (20) and a deposition mask (30) that is arranged between the deposition source (20) and the deposition surface. The depo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: LIFKA, Herbert
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator LIFKA, Herbert
description A deposition arrangement (1) is provided for depositing a substance (SB) on a substrate surface (ST1) of a substrate (ST). The deposition arrangement comprises a deposition source (20) and a deposition mask (30) that is arranged between the deposition source (20) and the deposition surface. The deposition mask (30) has a first mask surface (38) facing the deposition source and a second mask surface (39) facing the substrate surface (ST1). The deposition mask (30) is provided with a spatial pattern defined by at least one closed area (34) and at least one perforated area (36) defined by a plurality of through holes (37) and wherein a substrate carrier (10) is provided to carry the substrate with its substrate surface (ST1) at distance (D) from the second mask surface (39).
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3272901A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3272901A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3272901A13</originalsourceid><addsrcrecordid>eNrjZDBwcQ3wD_YM8fT3U3AMCnL0c3f1dfULUXD0c1HwdQ3x8HdRcPMPUoCp8nPnYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgHGRuZGlgaGjobGRCgBAO69JfI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DEPOSITION ARRANGEMENT AND METHOD FOR DEPOSITING</title><source>esp@cenet</source><creator>LIFKA, Herbert</creator><creatorcontrib>LIFKA, Herbert</creatorcontrib><description>A deposition arrangement (1) is provided for depositing a substance (SB) on a substrate surface (ST1) of a substrate (ST). The deposition arrangement comprises a deposition source (20) and a deposition mask (30) that is arranged between the deposition source (20) and the deposition surface. The deposition mask (30) has a first mask surface (38) facing the deposition source and a second mask surface (39) facing the substrate surface (ST1). The deposition mask (30) is provided with a spatial pattern defined by at least one closed area (34) and at least one perforated area (36) defined by a plurality of through holes (37) and wherein a substrate carrier (10) is provided to carry the substrate with its substrate surface (ST1) at distance (D) from the second mask surface (39).</description><language>eng ; fre ; ger</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180124&amp;DB=EPODOC&amp;CC=EP&amp;NR=3272901A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,782,887,25571,76555</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180124&amp;DB=EPODOC&amp;CC=EP&amp;NR=3272901A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIFKA, Herbert</creatorcontrib><title>DEPOSITION ARRANGEMENT AND METHOD FOR DEPOSITING</title><description>A deposition arrangement (1) is provided for depositing a substance (SB) on a substrate surface (ST1) of a substrate (ST). The deposition arrangement comprises a deposition source (20) and a deposition mask (30) that is arranged between the deposition source (20) and the deposition surface. The deposition mask (30) has a first mask surface (38) facing the deposition source and a second mask surface (39) facing the substrate surface (ST1). The deposition mask (30) is provided with a spatial pattern defined by at least one closed area (34) and at least one perforated area (36) defined by a plurality of through holes (37) and wherein a substrate carrier (10) is provided to carry the substrate with its substrate surface (ST1) at distance (D) from the second mask surface (39).</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBwcQ3wD_YM8fT3U3AMCnL0c3f1dfULUXD0c1HwdQ3x8HdRcPMPUoCp8nPnYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgHGRuZGlgaGjobGRCgBAO69JfI</recordid><startdate>20180124</startdate><enddate>20180124</enddate><creator>LIFKA, Herbert</creator><scope>EVB</scope></search><sort><creationdate>20180124</creationdate><title>DEPOSITION ARRANGEMENT AND METHOD FOR DEPOSITING</title><author>LIFKA, Herbert</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3272901A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>LIFKA, Herbert</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIFKA, Herbert</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEPOSITION ARRANGEMENT AND METHOD FOR DEPOSITING</title><date>2018-01-24</date><risdate>2018</risdate><abstract>A deposition arrangement (1) is provided for depositing a substance (SB) on a substrate surface (ST1) of a substrate (ST). The deposition arrangement comprises a deposition source (20) and a deposition mask (30) that is arranged between the deposition source (20) and the deposition surface. The deposition mask (30) has a first mask surface (38) facing the deposition source and a second mask surface (39) facing the substrate surface (ST1). The deposition mask (30) is provided with a spatial pattern defined by at least one closed area (34) and at least one perforated area (36) defined by a plurality of through holes (37) and wherein a substrate carrier (10) is provided to carry the substrate with its substrate surface (ST1) at distance (D) from the second mask surface (39).</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP3272901A1
source esp@cenet
subjects CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title DEPOSITION ARRANGEMENT AND METHOD FOR DEPOSITING
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-05T18%3A35%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIFKA,%20Herbert&rft.date=2018-01-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3272901A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true