UNRELEASED THERMOPILE INFRARED SENSOR USING MATERIAL TRANSFER METHOD

An unreleased thermopile IR sensor and method of fabrication is provided which includes a new thermally isolating material and an ultra-thin material based sensor which, in combination, provide excellent sensitivity without requiring a released membrane structure. The sensor is fabricated using a wa...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Marinescu, Radu, Kropelnicki, Piotr, Chuan, Kai Liang, Huminic, Grigore, Karagoezoglu, Hermann
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS COLORIMETRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING PHYSICS RADIATION PYROMETRY SEMICONDUCTOR DEVICES TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	Marinescu, Radu Kropelnicki, Piotr Chuan, Kai Liang Huminic, Grigore Karagoezoglu, Hermann
description	An unreleased thermopile IR sensor and method of fabrication is provided which includes a new thermally isolating material and an ultra-thin material based sensor which, in combination, provide excellent sensitivity without requiring a released membrane structure. The sensor is fabricated using a wafer transfer technique in which a substrate assembly comprising the substrate and new thermally isolating material is bonded to a carrier substrate assembly comprising a carrier substrate and the ultra-thin material, followed by removal of the carrier substrate. As such, temperature restrictions of the various materials are overcome.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3270129A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3270129A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3270129A13</originalsourceid><addsrcrecordid>eNrjZHAJ9Qty9XF1DHZ1UQjxcA3y9Q_w9HFV8PRzC3IMAooFu_oF-wcphAZ7-rkr-DqGuAZ5OvoohAQ5-gW7uQYp-LqGePi78DCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSSeNcAYyNzA0MjS0dDYyKUAAAqnCuk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>UNRELEASED THERMOPILE INFRARED SENSOR USING MATERIAL TRANSFER METHOD</title><source>esp@cenet</source><creator>Marinescu, Radu ; Kropelnicki, Piotr ; Chuan, Kai Liang ; Huminic, Grigore ; Karagoezoglu, Hermann</creator><creatorcontrib>Marinescu, Radu ; Kropelnicki, Piotr ; Chuan, Kai Liang ; Huminic, Grigore ; Karagoezoglu, Hermann</creatorcontrib><description>An unreleased thermopile IR sensor and method of fabrication is provided which includes a new thermally isolating material and an ultra-thin material based sensor which, in combination, provide excellent sensitivity without requiring a released membrane structure. The sensor is fabricated using a wafer transfer technique in which a substrate assembly comprising the substrate and new thermally isolating material is bonded to a carrier substrate assembly comprising a carrier substrate and the ultra-thin material, followed by removal of the carrier substrate. As such, temperature restrictions of the various materials are overcome.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; COLORIMETRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT ; MEASURING ; PHYSICS ; RADIATION PYROMETRY ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180117&DB=EPODOC&CC=EP&NR=3270129A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180117&DB=EPODOC&CC=EP&NR=3270129A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Marinescu, Radu</creatorcontrib><creatorcontrib>Kropelnicki, Piotr</creatorcontrib><creatorcontrib>Chuan, Kai Liang</creatorcontrib><creatorcontrib>Huminic, Grigore</creatorcontrib><creatorcontrib>Karagoezoglu, Hermann</creatorcontrib><title>UNRELEASED THERMOPILE INFRARED SENSOR USING MATERIAL TRANSFER METHOD</title><description>An unreleased thermopile IR sensor and method of fabrication is provided which includes a new thermally isolating material and an ultra-thin material based sensor which, in combination, provide excellent sensitivity without requiring a released membrane structure. The sensor is fabricated using a wafer transfer technique in which a substrate assembly comprising the substrate and new thermally isolating material is bonded to a carrier substrate assembly comprising a carrier substrate and the ultra-thin material, followed by removal of the carrier substrate. As such, temperature restrictions of the various materials are overcome.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>COLORIMETRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>RADIATION PYROMETRY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAJ9Qty9XF1DHZ1UQjxcA3y9Q_w9HFV8PRzC3IMAooFu_oF-wcphAZ7-rkr-DqGuAZ5OvoohAQ5-gW7uQYp-LqGePi78DCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSSeNcAYyNzA0MjS0dDYyKUAAAqnCuk</recordid><startdate>20180117</startdate><enddate>20180117</enddate><creator>Marinescu, Radu</creator><creator>Kropelnicki, Piotr</creator><creator>Chuan, Kai Liang</creator><creator>Huminic, Grigore</creator><creator>Karagoezoglu, Hermann</creator><scope>EVB</scope></search><sort><creationdate>20180117</creationdate><title>UNRELEASED THERMOPILE INFRARED SENSOR USING MATERIAL TRANSFER METHOD</title><author>Marinescu, Radu ; Kropelnicki, Piotr ; Chuan, Kai Liang ; Huminic, Grigore ; Karagoezoglu, Hermann</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3270129A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>COLORIMETRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>RADIATION PYROMETRY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Marinescu, Radu</creatorcontrib><creatorcontrib>Kropelnicki, Piotr</creatorcontrib><creatorcontrib>Chuan, Kai Liang</creatorcontrib><creatorcontrib>Huminic, Grigore</creatorcontrib><creatorcontrib>Karagoezoglu, Hermann</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Marinescu, Radu</au><au>Kropelnicki, Piotr</au><au>Chuan, Kai Liang</au><au>Huminic, Grigore</au><au>Karagoezoglu, Hermann</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>UNRELEASED THERMOPILE INFRARED SENSOR USING MATERIAL TRANSFER METHOD</title><date>2018-01-17</date><risdate>2018</risdate><abstract>An unreleased thermopile IR sensor and method of fabrication is provided which includes a new thermally isolating material and an ultra-thin material based sensor which, in combination, provide excellent sensitivity without requiring a released membrane structure. The sensor is fabricated using a wafer transfer technique in which a substrate assembly comprising the substrate and new thermally isolating material is bonded to a carrier substrate assembly comprising a carrier substrate and the ultra-thin material, followed by removal of the carrier substrate. As such, temperature restrictions of the various materials are overcome.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; fre ; ger
recordid	cdi_epo_espacenet_EP3270129A1
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS COLORIMETRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING PHYSICS RADIATION PYROMETRY SEMICONDUCTOR DEVICES TESTING
title	UNRELEASED THERMOPILE INFRARED SENSOR USING MATERIAL TRANSFER METHOD
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-14T12%3A42%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Marinescu,%20Radu&rft.date=2018-01-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3270129A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true