HEATING ELEMENT FOR SMD MOUNTING, ELECTRONIC ASSEMBLY HAVING SUCH A HEATING ELEMENT, AND METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY

The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrie...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WITTREICH, Ulrich, HUTH, Heiko, SEEHASE, Dirk, MÜLLER, Bernd, NOWOTTNICK, Mathias, LUDECK, Wolfgang, HANISCH, Michael, WORMUTH, Dirk, PRIHODOVSKY, Andrey
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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