ELECTRONIC ASSEMBLY WITH ONE OR MORE HEAT SINKS

An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresp...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SINGH, Brij, N, WIELAND, Andrew, D, ROAN, Thomas, CLEMENTS, Neal, D
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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