ELECTRONIC ASSEMBLY WITH ONE OR MORE HEAT SINKS

ELECTRONIC ASSEMBLY WITH ONE OR MORE HEAT SINKS

An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresp...

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Hauptverfasser: SINGH, Brij, N, WIELAND, Andrew, D, ROAN, Thomas, CLEMENTS, Neal, D
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SINGH, Brij, N
WIELAND, Andrew, D
ROAN, Thomas
CLEMENTS, Neal, D
description An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ELECTRONIC ASSEMBLY WITH ONE OR MORE HEAT SINKS
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