LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES USING THE MULTI PHOTON ABSORPTION METHOD

Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WATKINS, James, Joseph, WILCOX, Chad, Michael, PIECH, Garrett, Andrew, WIELAND, Kristopher, Allen, NGOM, Moussa
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	WATKINS, James, Joseph WILCOX, Chad, Michael PIECH, Garrett, Andrew WIELAND, Kristopher, Allen NGOM, Moussa
description	Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3245166B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3245166B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3245166B13</originalsourceid><addsrcrecordid>eNqNyjEKwjAUgOEsDlK9w7uAQ612T9pXE0iakPeCOJUi6SRaqPfHCh7A6f-HbyuuVhJGaBKz6S_gO2CN0Ulrb8DoAkZsgZIijpKRINGXrQZcsmwgaM--B6nIx8BmXYesfbsTm2l8LHn_ayGgQ270Ic-vIS_zeM_P_B4wVMfTuaxrVVZ_kA-biDEM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES USING THE MULTI PHOTON ABSORPTION METHOD</title><source>esp@cenet</source><creator>WATKINS, James, Joseph ; WILCOX, Chad, Michael ; PIECH, Garrett, Andrew ; WIELAND, Kristopher, Allen ; NGOM, Moussa</creator><creatorcontrib>WATKINS, James, Joseph ; WILCOX, Chad, Michael ; PIECH, Garrett, Andrew ; WIELAND, Kristopher, Allen ; NGOM, Moussa</creatorcontrib><description>Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.</description><language>eng ; fre ; ger</language><subject>CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; GLASS ; MACHINE TOOLS ; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; MINERAL OR SLAG WOOL ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200527&DB=EPODOC&CC=EP&NR=3245166B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200527&DB=EPODOC&CC=EP&NR=3245166B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WATKINS, James, Joseph</creatorcontrib><creatorcontrib>WILCOX, Chad, Michael</creatorcontrib><creatorcontrib>PIECH, Garrett, Andrew</creatorcontrib><creatorcontrib>WIELAND, Kristopher, Allen</creatorcontrib><creatorcontrib>NGOM, Moussa</creatorcontrib><title>LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES USING THE MULTI PHOTON ABSORPTION METHOD</title><description>Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.</description><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>GLASS</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjEKwjAUgOEsDlK9w7uAQ612T9pXE0iakPeCOJUi6SRaqPfHCh7A6f-HbyuuVhJGaBKz6S_gO2CN0Ulrb8DoAkZsgZIijpKRINGXrQZcsmwgaM--B6nIx8BmXYesfbsTm2l8LHn_ayGgQ270Ic-vIS_zeM_P_B4wVMfTuaxrVVZ_kA-biDEM</recordid><startdate>20200527</startdate><enddate>20200527</enddate><creator>WATKINS, James, Joseph</creator><creator>WILCOX, Chad, Michael</creator><creator>PIECH, Garrett, Andrew</creator><creator>WIELAND, Kristopher, Allen</creator><creator>NGOM, Moussa</creator><scope>EVB</scope></search><sort><creationdate>20200527</creationdate><title>LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES USING THE MULTI PHOTON ABSORPTION METHOD</title><author>WATKINS, James, Joseph ; WILCOX, Chad, Michael ; PIECH, Garrett, Andrew ; WIELAND, Kristopher, Allen ; NGOM, Moussa</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3245166B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2020</creationdate><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>GLASS</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>WATKINS, James, Joseph</creatorcontrib><creatorcontrib>WILCOX, Chad, Michael</creatorcontrib><creatorcontrib>PIECH, Garrett, Andrew</creatorcontrib><creatorcontrib>WIELAND, Kristopher, Allen</creatorcontrib><creatorcontrib>NGOM, Moussa</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WATKINS, James, Joseph</au><au>WILCOX, Chad, Michael</au><au>PIECH, Garrett, Andrew</au><au>WIELAND, Kristopher, Allen</au><au>NGOM, Moussa</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES USING THE MULTI PHOTON ABSORPTION METHOD</title><date>2020-05-27</date><risdate>2020</risdate><abstract>Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; fre ; ger
recordid	cdi_epo_espacenet_EP3245166B1
source	esp@cenet
subjects	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
title	LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES USING THE MULTI PHOTON ABSORPTION METHOD
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T23%3A51%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WATKINS,%20James,%20Joseph&rft.date=2020-05-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3245166B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true