THERMOELECTRIC MODULE AND MANUFACTURING METHOD THEREOF

The present disclosure discloses a thermoelectric module to which a bonding technique for stably driving the thermoelectric module at high temperatures is applied and a method of manufacturing the thermoelectric module. The thermoelectric module according to the present disclosure includes thermoele...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK, Ye-Rok, LEE, Seung-Hyup, PARK, Cheol-Hee, KIM, Dong-Sik, LEE, Dae-Ki, LEE, Jae-Ki, LIM, Byung-Kyu, CHOI, Hyun-Woo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ELECTRICITY
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