THERMAL FLUID FLOW-RATE SENSOR

THERMAL FLUID FLOW-RATE SENSOR

Degradation of reliability of a thermal fluid flow sensor, caused by generation of a crack in an insulating film is prevented in the thermal fluid flow sensor including a detection section and a circuit section formed on the same substrate when stress adjustment is performed by forming a deep concav...

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Hauptverfasser: ONOSE, Yasuo, DOI, Ryosuke, SAKUMA, Noriyuki, TASHIRO, Shinobu
Format: Patent
Sprache:eng ; fre ; ger
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MEASURING
MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL
METERING BY VOLUME
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PHYSICS
TESTING
TRANSPORTING
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creator ONOSE, Yasuo
DOI, Ryosuke
SAKUMA, Noriyuki
TASHIRO, Shinobu
description Degradation of reliability of a thermal fluid flow sensor, caused by generation of a crack in an insulating film is prevented in the thermal fluid flow sensor including a detection section and a circuit section formed on the same substrate when stress adjustment is performed by forming a deep concave portion in an interlayer insulating film in the detection section and forming the insulating film having a tensile stress thereon. As a means thereof, stair-like step is provided in a side wall of a concave portion, formed in the interlayer insulating film on a diaphragm. Accordingly, each depth of a first concave portion and a second concave portion, which form the concave portion, is reduced, and coatability of the insulating film for the stress adjustment, which covers a side wall and a bottom face of the concave portion, is improved.
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subjects MEASURING
MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL
METERING BY VOLUME
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PHYSICS
TESTING
TRANSPORTING
title THERMAL FLUID FLOW-RATE SENSOR
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