METHOD OF MANUFACTURING HOUSING STRUCTURE AND HOUSING STRUCTURE
A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facin...
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creator | MATSUI, Noriaki HOTTA, Kensaku KUTSUMI, Hiroshi MORIUCHI, Toshihiro KOSUMI, Yuki YAO, Fu KOYAMA, Shoichi HARAGUCHI, Satoshi KAJITANI, Masafumi TAKEUCHI, Akihiro YUKIMURA, Takahiro |
description | A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facing side surfaces of the second circuit portion. The flow resistance of a resin flowing through a space between each side surface of the second circuit portion and the corresponding side wall surface is lower than that of the resin flowing through a space between the upper surface of the second circuit portion and the upper wall surface. Then, the electronic unit is placed in the mold. A distance between each of the side surfaces of the second circuit portion and the corresponding side wall surface is longer than a distance between the upper surface of the second circuit portion and the upper wall surface. Then, the resin is injected into the mold in which the electronic unit has been placed. Thus, the electronic unit and the housing in which the electronic unit is housed are integrated with each other. Further, there is provided a housing structure that includes an electronic unit including a first circuit portion having an annular shape and a second circuit portion protruding radially outward from the first circuit portion, and a housing in which the electronic unit is housed, the housing being integral with the electronic unit, wherein the second circuit portion comprises a main body portion extending radially outward from the first circuit portion. The housing structure is further provided with a tapered portion protruding from the main body portion in a direction in which a central axis of the first circuit portion extends or a terminal extending radially outward from the main body portion and
an extending portion extending to a position radially outward of the terminal. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3238905A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3238905A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3238905A23</originalsourceid><addsrcrecordid>eNrjZLD3dQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1fw8A8NBtHBIUGhIDFXBUc_F0xRHgbWtMSc4lReKM3NoODmGuLsoZtakB-fWlyQmJyal1oS7xpgbGRsYWlg6mhkTIQSAGXJKoU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF MANUFACTURING HOUSING STRUCTURE AND HOUSING STRUCTURE</title><source>esp@cenet</source><creator>MATSUI, Noriaki ; HOTTA, Kensaku ; KUTSUMI, Hiroshi ; MORIUCHI, Toshihiro ; KOSUMI, Yuki ; YAO, Fu ; KOYAMA, Shoichi ; HARAGUCHI, Satoshi ; KAJITANI, Masafumi ; TAKEUCHI, Akihiro ; YUKIMURA, Takahiro</creator><creatorcontrib>MATSUI, Noriaki ; HOTTA, Kensaku ; KUTSUMI, Hiroshi ; MORIUCHI, Toshihiro ; KOSUMI, Yuki ; YAO, Fu ; KOYAMA, Shoichi ; HARAGUCHI, Satoshi ; KAJITANI, Masafumi ; TAKEUCHI, Akihiro ; YUKIMURA, Takahiro</creatorcontrib><description>A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facing side surfaces of the second circuit portion. The flow resistance of a resin flowing through a space between each side surface of the second circuit portion and the corresponding side wall surface is lower than that of the resin flowing through a space between the upper surface of the second circuit portion and the upper wall surface. Then, the electronic unit is placed in the mold. A distance between each of the side surfaces of the second circuit portion and the corresponding side wall surface is longer than a distance between the upper surface of the second circuit portion and the upper wall surface. Then, the resin is injected into the mold in which the electronic unit has been placed. Thus, the electronic unit and the housing in which the electronic unit is housed are integrated with each other. Further, there is provided a housing structure that includes an electronic unit including a first circuit portion having an annular shape and a second circuit portion protruding radially outward from the first circuit portion, and a housing in which the electronic unit is housed, the housing being integral with the electronic unit, wherein the second circuit portion comprises a main body portion extending radially outward from the first circuit portion. The housing structure is further provided with a tapered portion protruding from the main body portion in a direction in which a central axis of the first circuit portion extends or a terminal extending radially outward from the main body portion and
an extending portion extending to a position radially outward of the terminal.</description><language>eng ; fre ; ger</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; PERFORMING OPERATIONS ; PHYSICS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TESTING ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171101&DB=EPODOC&CC=EP&NR=3238905A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171101&DB=EPODOC&CC=EP&NR=3238905A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MATSUI, Noriaki</creatorcontrib><creatorcontrib>HOTTA, Kensaku</creatorcontrib><creatorcontrib>KUTSUMI, Hiroshi</creatorcontrib><creatorcontrib>MORIUCHI, Toshihiro</creatorcontrib><creatorcontrib>KOSUMI, Yuki</creatorcontrib><creatorcontrib>YAO, Fu</creatorcontrib><creatorcontrib>KOYAMA, Shoichi</creatorcontrib><creatorcontrib>HARAGUCHI, Satoshi</creatorcontrib><creatorcontrib>KAJITANI, Masafumi</creatorcontrib><creatorcontrib>TAKEUCHI, Akihiro</creatorcontrib><creatorcontrib>YUKIMURA, Takahiro</creatorcontrib><title>METHOD OF MANUFACTURING HOUSING STRUCTURE AND HOUSING STRUCTURE</title><description>A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facing side surfaces of the second circuit portion. The flow resistance of a resin flowing through a space between each side surface of the second circuit portion and the corresponding side wall surface is lower than that of the resin flowing through a space between the upper surface of the second circuit portion and the upper wall surface. Then, the electronic unit is placed in the mold. A distance between each of the side surfaces of the second circuit portion and the corresponding side wall surface is longer than a distance between the upper surface of the second circuit portion and the upper wall surface. Then, the resin is injected into the mold in which the electronic unit has been placed. Thus, the electronic unit and the housing in which the electronic unit is housed are integrated with each other. Further, there is provided a housing structure that includes an electronic unit including a first circuit portion having an annular shape and a second circuit portion protruding radially outward from the first circuit portion, and a housing in which the electronic unit is housed, the housing being integral with the electronic unit, wherein the second circuit portion comprises a main body portion extending radially outward from the first circuit portion. The housing structure is further provided with a tapered portion protruding from the main body portion in a direction in which a central axis of the first circuit portion extends or a terminal extending radially outward from the main body portion and
an extending portion extending to a position radially outward of the terminal.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>MEASURING</subject><subject>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD3dQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1fw8A8NBtHBIUGhIDFXBUc_F0xRHgbWtMSc4lReKM3NoODmGuLsoZtakB-fWlyQmJyal1oS7xpgbGRsYWlg6mhkTIQSAGXJKoU</recordid><startdate>20171101</startdate><enddate>20171101</enddate><creator>MATSUI, Noriaki</creator><creator>HOTTA, Kensaku</creator><creator>KUTSUMI, Hiroshi</creator><creator>MORIUCHI, Toshihiro</creator><creator>KOSUMI, Yuki</creator><creator>YAO, Fu</creator><creator>KOYAMA, Shoichi</creator><creator>HARAGUCHI, Satoshi</creator><creator>KAJITANI, Masafumi</creator><creator>TAKEUCHI, Akihiro</creator><creator>YUKIMURA, Takahiro</creator><scope>EVB</scope></search><sort><creationdate>20171101</creationdate><title>METHOD OF MANUFACTURING HOUSING STRUCTURE AND HOUSING STRUCTURE</title><author>MATSUI, Noriaki ; HOTTA, Kensaku ; KUTSUMI, Hiroshi ; MORIUCHI, Toshihiro ; KOSUMI, Yuki ; YAO, Fu ; KOYAMA, Shoichi ; HARAGUCHI, Satoshi ; KAJITANI, Masafumi ; TAKEUCHI, Akihiro ; YUKIMURA, Takahiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3238905A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2017</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>MEASURING</topic><topic>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>MATSUI, Noriaki</creatorcontrib><creatorcontrib>HOTTA, Kensaku</creatorcontrib><creatorcontrib>KUTSUMI, Hiroshi</creatorcontrib><creatorcontrib>MORIUCHI, Toshihiro</creatorcontrib><creatorcontrib>KOSUMI, Yuki</creatorcontrib><creatorcontrib>YAO, Fu</creatorcontrib><creatorcontrib>KOYAMA, Shoichi</creatorcontrib><creatorcontrib>HARAGUCHI, Satoshi</creatorcontrib><creatorcontrib>KAJITANI, Masafumi</creatorcontrib><creatorcontrib>TAKEUCHI, Akihiro</creatorcontrib><creatorcontrib>YUKIMURA, Takahiro</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MATSUI, Noriaki</au><au>HOTTA, Kensaku</au><au>KUTSUMI, Hiroshi</au><au>MORIUCHI, Toshihiro</au><au>KOSUMI, Yuki</au><au>YAO, Fu</au><au>KOYAMA, Shoichi</au><au>HARAGUCHI, Satoshi</au><au>KAJITANI, Masafumi</au><au>TAKEUCHI, Akihiro</au><au>YUKIMURA, Takahiro</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF MANUFACTURING HOUSING STRUCTURE AND HOUSING STRUCTURE</title><date>2017-11-01</date><risdate>2017</risdate><abstract>A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facing side surfaces of the second circuit portion. The flow resistance of a resin flowing through a space between each side surface of the second circuit portion and the corresponding side wall surface is lower than that of the resin flowing through a space between the upper surface of the second circuit portion and the upper wall surface. Then, the electronic unit is placed in the mold. A distance between each of the side surfaces of the second circuit portion and the corresponding side wall surface is longer than a distance between the upper surface of the second circuit portion and the upper wall surface. Then, the resin is injected into the mold in which the electronic unit has been placed. Thus, the electronic unit and the housing in which the electronic unit is housed are integrated with each other. Further, there is provided a housing structure that includes an electronic unit including a first circuit portion having an annular shape and a second circuit portion protruding radially outward from the first circuit portion, and a housing in which the electronic unit is housed, the housing being integral with the electronic unit, wherein the second circuit portion comprises a main body portion extending radially outward from the first circuit portion. The housing structure is further provided with a tapered portion protruding from the main body portion in a direction in which a central axis of the first circuit portion extends or a terminal extending radially outward from the main body portion and
an extending portion extending to a position radially outward of the terminal.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
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subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PERFORMING OPERATIONS PHYSICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TESTING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
title | METHOD OF MANUFACTURING HOUSING STRUCTURE AND HOUSING STRUCTURE |
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