ENCAPSULATION OF ELECTRONIC COMPONENTS IN POLYMER MATERIALS
The invention relates to an electronic component (1) comprising at least one semiconductor chip (4) and at least one substrate (6), the semiconductor chip (4) being encapsulated in a polyorganosiloxane resin (3), which is the result of hardening a composition comprising at least: one portion (A) com...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | CHIKH, Linda BANET, Philippe FOUET, Thomas FICHET, Odile |
| description | The invention relates to an electronic component (1) comprising at least one semiconductor chip (4) and at least one substrate (6), the semiconductor chip (4) being encapsulated in a polyorganosiloxane resin (3), which is the result of hardening a composition comprising at least: one portion (A) comprising at least one polyorganosiloxane (A1) which contains at least two -CH═CH2 reactive groups per molecule; one portion (B) comprising a polyorganosiloxane (B1) which comprises at least two Si-H groups per molecule; and at least one hydrosilation catalyst (C1), the components (A1) and (B1) being in quantities such that the molar ratio of Si-H/-CH═CH2 in the composition is no lower than 0.4. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3224320A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3224320A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3224320A13</originalsourceid><addsrcrecordid>eNrjZLB29XN2DAgO9XEM8fT3U_B3U3D1cXUOCfL383RWcPb3DfD3c_ULCVbw9FMI8PeJ9HUNUvB1DHEN8nT0CeZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAcZGRibGRgaOhsZEKAEAsd0pJA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ENCAPSULATION OF ELECTRONIC COMPONENTS IN POLYMER MATERIALS</title><source>esp@cenet</source><creator>CHIKH, Linda ; BANET, Philippe ; FOUET, Thomas ; FICHET, Odile</creator><creatorcontrib>CHIKH, Linda ; BANET, Philippe ; FOUET, Thomas ; FICHET, Odile</creatorcontrib><description>The invention relates to an electronic component (1) comprising at least one semiconductor chip (4) and at least one substrate (6), the semiconductor chip (4) being encapsulated in a polyorganosiloxane resin (3), which is the result of hardening a composition comprising at least: one portion (A) comprising at least one polyorganosiloxane (A1) which contains at least two -CH═CH2 reactive groups per molecule; one portion (B) comprising a polyorganosiloxane (B1) which comprises at least two Si-H groups per molecule; and at least one hydrosilation catalyst (C1), the components (A1) and (B1) being in quantities such that the molar ratio of Si-H/-CH═CH2 in the composition is no lower than 0.4.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171004&DB=EPODOC&CC=EP&NR=3224320A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171004&DB=EPODOC&CC=EP&NR=3224320A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHIKH, Linda</creatorcontrib><creatorcontrib>BANET, Philippe</creatorcontrib><creatorcontrib>FOUET, Thomas</creatorcontrib><creatorcontrib>FICHET, Odile</creatorcontrib><title>ENCAPSULATION OF ELECTRONIC COMPONENTS IN POLYMER MATERIALS</title><description>The invention relates to an electronic component (1) comprising at least one semiconductor chip (4) and at least one substrate (6), the semiconductor chip (4) being encapsulated in a polyorganosiloxane resin (3), which is the result of hardening a composition comprising at least: one portion (A) comprising at least one polyorganosiloxane (A1) which contains at least two -CH═CH2 reactive groups per molecule; one portion (B) comprising a polyorganosiloxane (B1) which comprises at least two Si-H groups per molecule; and at least one hydrosilation catalyst (C1), the components (A1) and (B1) being in quantities such that the molar ratio of Si-H/-CH═CH2 in the composition is no lower than 0.4.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB29XN2DAgO9XEM8fT3U_B3U3D1cXUOCfL383RWcPb3DfD3c_ULCVbw9FMI8PeJ9HUNUvB1DHEN8nT0CeZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAcZGRibGRgaOhsZEKAEAsd0pJA</recordid><startdate>20171004</startdate><enddate>20171004</enddate><creator>CHIKH, Linda</creator><creator>BANET, Philippe</creator><creator>FOUET, Thomas</creator><creator>FICHET, Odile</creator><scope>EVB</scope></search><sort><creationdate>20171004</creationdate><title>ENCAPSULATION OF ELECTRONIC COMPONENTS IN POLYMER MATERIALS</title><author>CHIKH, Linda ; BANET, Philippe ; FOUET, Thomas ; FICHET, Odile</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3224320A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>CHIKH, Linda</creatorcontrib><creatorcontrib>BANET, Philippe</creatorcontrib><creatorcontrib>FOUET, Thomas</creatorcontrib><creatorcontrib>FICHET, Odile</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHIKH, Linda</au><au>BANET, Philippe</au><au>FOUET, Thomas</au><au>FICHET, Odile</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ENCAPSULATION OF ELECTRONIC COMPONENTS IN POLYMER MATERIALS</title><date>2017-10-04</date><risdate>2017</risdate><abstract>The invention relates to an electronic component (1) comprising at least one semiconductor chip (4) and at least one substrate (6), the semiconductor chip (4) being encapsulated in a polyorganosiloxane resin (3), which is the result of hardening a composition comprising at least: one portion (A) comprising at least one polyorganosiloxane (A1) which contains at least two -CH═CH2 reactive groups per molecule; one portion (B) comprising a polyorganosiloxane (B1) which comprises at least two Si-H groups per molecule; and at least one hydrosilation catalyst (C1), the components (A1) and (B1) being in quantities such that the molar ratio of Si-H/-CH═CH2 in the composition is no lower than 0.4.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP3224320A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | ENCAPSULATION OF ELECTRONIC COMPONENTS IN POLYMER MATERIALS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-16T18%3A19%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHIKH,%20Linda&rft.date=2017-10-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3224320A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |