PACKAGE FOR ELECTRONIC SYSTEM HAVING SEMICONDUCTOR CHIPS
An electronic system comprises a first chip of single-crystalline semiconductor shaped as a hexahedron and including a first electronic device embedded in a second chip of single-crystalline semiconductor shaped as a container having a slab bordered by retaining walls, and including a second electro...
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| creator | MOLLOY, Simon John LOPEZ, Osvaldo Jorge NOQUIL, Jonathan Almeria GREBS, Thomas Eugene |
| description | An electronic system comprises a first chip of single-crystalline semiconductor shaped as a hexahedron and including a first electronic device embedded in a second chip of single-crystalline semiconductor shaped as a container having a slab bordered by retaining walls, and including a second electronic device. The container shaped as a slab bordered by the retaining walls and including conductive traces and terminals. The first chip is attached to the slab of second chip, forming nested chips. The first and second chips embedded in the container. The nested first and second chips are operable as an electronic system and the container is operable as the package of the system. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3218930A4</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3218930A4</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3218930A43</originalsourceid><addsrcrecordid>eNrjZLAIcHT2dnR3VXDzD1Jw9XF1Dgny9_N0VgiODA5x9VXwcAzz9HNXCHb19XT293MJdQ4BKnP28AwI5mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxkaGFpbGBo4mxkQoAQAeZSg0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PACKAGE FOR ELECTRONIC SYSTEM HAVING SEMICONDUCTOR CHIPS</title><source>esp@cenet</source><creator>MOLLOY, Simon John ; LOPEZ, Osvaldo Jorge ; NOQUIL, Jonathan Almeria ; GREBS, Thomas Eugene</creator><creatorcontrib>MOLLOY, Simon John ; LOPEZ, Osvaldo Jorge ; NOQUIL, Jonathan Almeria ; GREBS, Thomas Eugene</creatorcontrib><description>An electronic system comprises a first chip of single-crystalline semiconductor shaped as a hexahedron and including a first electronic device embedded in a second chip of single-crystalline semiconductor shaped as a container having a slab bordered by retaining walls, and including a second electronic device. The container shaped as a slab bordered by the retaining walls and including conductive traces and terminals. The first chip is attached to the slab of second chip, forming nested chips. The first and second chips embedded in the container. The nested first and second chips are operable as an electronic system and the container is operable as the package of the system.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180725&DB=EPODOC&CC=EP&NR=3218930A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180725&DB=EPODOC&CC=EP&NR=3218930A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MOLLOY, Simon John</creatorcontrib><creatorcontrib>LOPEZ, Osvaldo Jorge</creatorcontrib><creatorcontrib>NOQUIL, Jonathan Almeria</creatorcontrib><creatorcontrib>GREBS, Thomas Eugene</creatorcontrib><title>PACKAGE FOR ELECTRONIC SYSTEM HAVING SEMICONDUCTOR CHIPS</title><description>An electronic system comprises a first chip of single-crystalline semiconductor shaped as a hexahedron and including a first electronic device embedded in a second chip of single-crystalline semiconductor shaped as a container having a slab bordered by retaining walls, and including a second electronic device. The container shaped as a slab bordered by the retaining walls and including conductive traces and terminals. The first chip is attached to the slab of second chip, forming nested chips. The first and second chips embedded in the container. The nested first and second chips are operable as an electronic system and the container is operable as the package of the system.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAIcHT2dnR3VXDzD1Jw9XF1Dgny9_N0VgiODA5x9VXwcAzz9HNXCHb19XT293MJdQ4BKnP28AwI5mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxkaGFpbGBo4mxkQoAQAeZSg0</recordid><startdate>20180725</startdate><enddate>20180725</enddate><creator>MOLLOY, Simon John</creator><creator>LOPEZ, Osvaldo Jorge</creator><creator>NOQUIL, Jonathan Almeria</creator><creator>GREBS, Thomas Eugene</creator><scope>EVB</scope></search><sort><creationdate>20180725</creationdate><title>PACKAGE FOR ELECTRONIC SYSTEM HAVING SEMICONDUCTOR CHIPS</title><author>MOLLOY, Simon John ; LOPEZ, Osvaldo Jorge ; NOQUIL, Jonathan Almeria ; GREBS, Thomas Eugene</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3218930A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MOLLOY, Simon John</creatorcontrib><creatorcontrib>LOPEZ, Osvaldo Jorge</creatorcontrib><creatorcontrib>NOQUIL, Jonathan Almeria</creatorcontrib><creatorcontrib>GREBS, Thomas Eugene</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MOLLOY, Simon John</au><au>LOPEZ, Osvaldo Jorge</au><au>NOQUIL, Jonathan Almeria</au><au>GREBS, Thomas Eugene</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PACKAGE FOR ELECTRONIC SYSTEM HAVING SEMICONDUCTOR CHIPS</title><date>2018-07-25</date><risdate>2018</risdate><abstract>An electronic system comprises a first chip of single-crystalline semiconductor shaped as a hexahedron and including a first electronic device embedded in a second chip of single-crystalline semiconductor shaped as a container having a slab bordered by retaining walls, and including a second electronic device. The container shaped as a slab bordered by the retaining walls and including conductive traces and terminals. The first chip is attached to the slab of second chip, forming nested chips. The first and second chips embedded in the container. The nested first and second chips are operable as an electronic system and the container is operable as the package of the system.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | PACKAGE FOR ELECTRONIC SYSTEM HAVING SEMICONDUCTOR CHIPS |
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