A METHOD FOR PHOTOLITHOGRAPHY-FREE SELF-ALIGNED REVERSE ACTIVE ETCH

A layer of partially planarized organosilicate (DUO) is spin-coated onto a layer of high density plasma (HDP) oxide on a silicon wafer after the shallow trench isolation (STI) is filled with the HDP oxide. Then the DUO layer is etched using a specialized process specifically tuned to etch the DUO an...

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Bibliographische Detailangaben
Hauptverfasser: SATO, Justin Hiroki, STOM, Gregory Allen
Format: Patent
Sprache:eng ; fre ; ger
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