LOW-TEMPERATURE PASSIVATION OF FERROELECTRIC INTEGRATED CIRCUITS FOR ENHANCED POLARIZATION PERFORMANCE

Curing of a passivation layer applied to the surface of a ferroelectric integrated circuit so as to enhance the polarization characteristics of the ferroelectric structures. A passivation layer, such as a polyimide, is applied to the surface of the ferroelectric integrated circuit after fabrication...

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Bibliographische Detailangaben
Hauptverfasser: WEN, Huang-Chun, SUMMERFELT, Scott, Robert, BAILEY, Richard, Allen, SAN, Kemal, Tamer, ACOSTA, Antonio, Guillermo, RODRIGUEZ, John, A
Format: Patent
Sprache:eng ; fre ; ger
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