METHOD OF MOLDING RIGID POLYURETHANE FOAMS WITH ENHANCED THERMAL CONDUCTIVITY
The present invention is to a process of producing a molded rigid polyurethane foam for application in appliance, having a reduced thermal conductivity at densities between 33 and 38 kg/m 3 . The molded rigid polyurethane foam have a ratio of applied foam density (kg/m 3 ) to lambda (mW/mK), measure...
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| creator | DE VOS, Hans PARENTI, Vanni |
| description | The present invention is to a process of producing a molded rigid polyurethane foam for application in appliance, having a reduced thermal conductivity at densities between 33 and 38 kg/m 3 . The molded rigid polyurethane foam have a ratio of applied foam density (kg/m 3 ) to lambda (mW/mK), measured at 10°C, 24 hours after foam production from 1.65 and to 2.15 and are obtained by the process of injecting into a closed mold cavity under reduced pressure a reaction mixture at a packing factor of 1.1 to 1.9 and the reaction mixture comprises:
A) an organic polyisocyanate;
B) a physical blowing agent;
C) a polyol composition containing at least one polyol with a functionality of 3 or greater and a hydroxyl number between 200 and 800 and a water content of 0 to 2.5 weight percent of the total polyol composition;
D) catalyst; and
E) auxiliary substances and/or additives. |
| format | Patent |
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A) an organic polyisocyanate;
B) a physical blowing agent;
C) a polyol composition containing at least one polyol with a functionality of 3 or greater and a hydroxyl number between 200 and 800 and a water content of 0 to 2.5 weight percent of the total polyol composition;
D) catalyst; and
E) auxiliary substances and/or additives.</description><language>eng ; fre ; ger</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; GENERAL PROCESSES OF COMPOUNDING ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241023&DB=EPODOC&CC=EP&NR=3190133B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241023&DB=EPODOC&CC=EP&NR=3190133B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DE VOS, Hans</creatorcontrib><creatorcontrib>PARENTI, Vanni</creatorcontrib><title>METHOD OF MOLDING RIGID POLYURETHANE FOAMS WITH ENHANCED THERMAL CONDUCTIVITY</title><description>The present invention is to a process of producing a molded rigid polyurethane foam for application in appliance, having a reduced thermal conductivity at densities between 33 and 38 kg/m 3 . The molded rigid polyurethane foam have a ratio of applied foam density (kg/m 3 ) to lambda (mW/mK), measured at 10°C, 24 hours after foam production from 1.65 and to 2.15 and are obtained by the process of injecting into a closed mold cavity under reduced pressure a reaction mixture at a packing factor of 1.1 to 1.9 and the reaction mixture comprises:
A) an organic polyisocyanate;
B) a physical blowing agent;
C) a polyol composition containing at least one polyol with a functionality of 3 or greater and a hydroxyl number between 200 and 800 and a water content of 0 to 2.5 weight percent of the total polyol composition;
D) catalyst; and
E) auxiliary substances and/or additives.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPD1dQ3x8HdR8HdT8PX3cfH0c1cI8nT3dFEI8PeJDA0CSjr6uSq4-Tv6BiuEe4Z4KLj6AUWcXV0UQjxcg3wdfRSc_f1cQp1DPMM8QyJ5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8a4CxoaWBobGxk6ExEUoAmCQt7w</recordid><startdate>20241023</startdate><enddate>20241023</enddate><creator>DE VOS, Hans</creator><creator>PARENTI, Vanni</creator><scope>EVB</scope></search><sort><creationdate>20241023</creationdate><title>METHOD OF MOLDING RIGID POLYURETHANE FOAMS WITH ENHANCED THERMAL CONDUCTIVITY</title><author>DE VOS, Hans ; PARENTI, Vanni</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3190133B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>DE VOS, Hans</creatorcontrib><creatorcontrib>PARENTI, Vanni</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DE VOS, Hans</au><au>PARENTI, Vanni</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF MOLDING RIGID POLYURETHANE FOAMS WITH ENHANCED THERMAL CONDUCTIVITY</title><date>2024-10-23</date><risdate>2024</risdate><abstract>The present invention is to a process of producing a molded rigid polyurethane foam for application in appliance, having a reduced thermal conductivity at densities between 33 and 38 kg/m 3 . The molded rigid polyurethane foam have a ratio of applied foam density (kg/m 3 ) to lambda (mW/mK), measured at 10°C, 24 hours after foam production from 1.65 and to 2.15 and are obtained by the process of injecting into a closed mold cavity under reduced pressure a reaction mixture at a packing factor of 1.1 to 1.9 and the reaction mixture comprises:
A) an organic polyisocyanate;
B) a physical blowing agent;
C) a polyol composition containing at least one polyol with a functionality of 3 or greater and a hydroxyl number between 200 and 800 and a water content of 0 to 2.5 weight percent of the total polyol composition;
D) catalyst; and
E) auxiliary substances and/or additives.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | METHOD OF MOLDING RIGID POLYURETHANE FOAMS WITH ENHANCED THERMAL CONDUCTIVITY |
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