COHESIVELY FAILING, NON-STAINING HOT MELT ADHESIVES

A non-pressure sensitive hot melt adhesive for use in mailer applications uses a styrenic block copolymer (SBC) with a hydrogenated mid-block as the primary polymer in the composition. The adhesive contains about 10% to about 50% by weight of the SBC, about 2% to about 30% by weight of a polyolefin...

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Bibliographische Detailangaben
Hauptverfasser: VITRANO, Michael D, KANDERSKI, Monina D
Format: Patent
Sprache:eng ; fre ; ger
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