METHOD FOR RELEASING A FIRST SUBSTRATE

A method and device for detaching a first substrate, which is connected to a second substrate by an interconnect layer, from the second substrate by embrittlement of the interconnect layer. A method for bonding of a first substrate to a second substrate with an interconnect layer which can be embrit...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Thallner, Erich
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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