METHOD FOR MANUFACTURING AN ELECTRONIC ELEMENT AND AN ELECTRONIC ELEMENT

A method for manufacturing an electronic component can include the following steps: providing a semiconductor arrangement comprising a carrier structure which has at least one semiconductor chip incorporated into a potting compound, and a redistribution layer which comprises a flexible material and...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Kahle, Ruben, Becker, Karl-Friedrich, Dr. Töpper, Michael, Dr. Braun, Tanja
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Kahle, Ruben
Becker, Karl-Friedrich
Dr. Töpper, Michael
Dr. Braun, Tanja
description A method for manufacturing an electronic component can include the following steps: providing a semiconductor arrangement comprising a carrier structure which has at least one semiconductor chip incorporated into a potting compound, and a redistribution layer which comprises a flexible material and at least one strip conductor, wherein the carrier structure at least in regions is connected to the redistribution layer, and the at least one semiconductor chip is electrically conductively connected to the redistribution layer, and separating the carrier structure along at least one trench in a manner such that the carrier structure is divided into at least two singularized carrier elements, wherein two adjacent ones of the singularized carrier elements are connected to one another over the respective trench by way of the redistribution layer.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3154077B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3154077B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3154077B13</originalsourceid><addsrcrecordid>eNrjZPDwdQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXcPRTcPVxdQ4J8vfzdAYxfV39QoCiLthleBhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJvGuAsaGpiYG5uZOhMRFKAJg0LEA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR MANUFACTURING AN ELECTRONIC ELEMENT AND AN ELECTRONIC ELEMENT</title><source>esp@cenet</source><creator>Kahle, Ruben ; Becker, Karl-Friedrich ; Dr. Töpper, Michael ; Dr. Braun, Tanja</creator><creatorcontrib>Kahle, Ruben ; Becker, Karl-Friedrich ; Dr. Töpper, Michael ; Dr. Braun, Tanja</creatorcontrib><description>A method for manufacturing an electronic component can include the following steps: providing a semiconductor arrangement comprising a carrier structure which has at least one semiconductor chip incorporated into a potting compound, and a redistribution layer which comprises a flexible material and at least one strip conductor, wherein the carrier structure at least in regions is connected to the redistribution layer, and the at least one semiconductor chip is electrically conductively connected to the redistribution layer, and separating the carrier structure along at least one trench in a manner such that the carrier structure is divided into at least two singularized carrier elements, wherein two adjacent ones of the singularized carrier elements are connected to one another over the respective trench by way of the redistribution layer.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210428&amp;DB=EPODOC&amp;CC=EP&amp;NR=3154077B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210428&amp;DB=EPODOC&amp;CC=EP&amp;NR=3154077B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kahle, Ruben</creatorcontrib><creatorcontrib>Becker, Karl-Friedrich</creatorcontrib><creatorcontrib>Dr. Töpper, Michael</creatorcontrib><creatorcontrib>Dr. Braun, Tanja</creatorcontrib><title>METHOD FOR MANUFACTURING AN ELECTRONIC ELEMENT AND AN ELECTRONIC ELEMENT</title><description>A method for manufacturing an electronic component can include the following steps: providing a semiconductor arrangement comprising a carrier structure which has at least one semiconductor chip incorporated into a potting compound, and a redistribution layer which comprises a flexible material and at least one strip conductor, wherein the carrier structure at least in regions is connected to the redistribution layer, and the at least one semiconductor chip is electrically conductively connected to the redistribution layer, and separating the carrier structure along at least one trench in a manner such that the carrier structure is divided into at least two singularized carrier elements, wherein two adjacent ones of the singularized carrier elements are connected to one another over the respective trench by way of the redistribution layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPDwdQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXcPRTcPVxdQ4J8vfzdAYxfV39QoCiLthleBhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJvGuAsaGpiYG5uZOhMRFKAJg0LEA</recordid><startdate>20210428</startdate><enddate>20210428</enddate><creator>Kahle, Ruben</creator><creator>Becker, Karl-Friedrich</creator><creator>Dr. Töpper, Michael</creator><creator>Dr. Braun, Tanja</creator><scope>EVB</scope></search><sort><creationdate>20210428</creationdate><title>METHOD FOR MANUFACTURING AN ELECTRONIC ELEMENT AND AN ELECTRONIC ELEMENT</title><author>Kahle, Ruben ; Becker, Karl-Friedrich ; Dr. Töpper, Michael ; Dr. Braun, Tanja</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3154077B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Kahle, Ruben</creatorcontrib><creatorcontrib>Becker, Karl-Friedrich</creatorcontrib><creatorcontrib>Dr. Töpper, Michael</creatorcontrib><creatorcontrib>Dr. Braun, Tanja</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kahle, Ruben</au><au>Becker, Karl-Friedrich</au><au>Dr. Töpper, Michael</au><au>Dr. Braun, Tanja</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING AN ELECTRONIC ELEMENT AND AN ELECTRONIC ELEMENT</title><date>2021-04-28</date><risdate>2021</risdate><abstract>A method for manufacturing an electronic component can include the following steps: providing a semiconductor arrangement comprising a carrier structure which has at least one semiconductor chip incorporated into a potting compound, and a redistribution layer which comprises a flexible material and at least one strip conductor, wherein the carrier structure at least in regions is connected to the redistribution layer, and the at least one semiconductor chip is electrically conductively connected to the redistribution layer, and separating the carrier structure along at least one trench in a manner such that the carrier structure is divided into at least two singularized carrier elements, wherein two adjacent ones of the singularized carrier elements are connected to one another over the respective trench by way of the redistribution layer.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP3154077B1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD FOR MANUFACTURING AN ELECTRONIC ELEMENT AND AN ELECTRONIC ELEMENT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-17T14%3A02%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kahle,%20Ruben&rft.date=2021-04-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3154077B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true