RADIATION-SENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE
There are provided a radiation-sensitive resin composition comprising a binder resin (A), radiation-sensitive compound (B), and cross-linking agent (C) represented by the following general formula (1), whereina content of the cross-linking agent (C) is 3 to 25 parts by weight with respect to 100 par...
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| creator | SHINDO, Hiroaki |
| description | There are provided a radiation-sensitive resin composition comprising a binder resin (A), radiation-sensitive compound (B), and cross-linking agent (C) represented by the following general formula (1), whereina content of the cross-linking agent (C) is 3 to 25 parts by weight with respect to 100 parts by weight of the binder resin (A):
wherein, in the general formula (1), each of R 1 to R 3 independently represents a hydrocarbon group having 1 to 10 carbon atoms. |
| format | Patent |
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wherein, in the general formula (1), each of R 1 to R 3 independently represents a hydrocarbon group having 1 to 10 carbon atoms.</description><language>eng ; fre ; ger</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTROGRAPHY ; GENERAL PROCESSES OF COMPOUNDING ; HOLOGRAPHY ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170301&DB=EPODOC&CC=EP&NR=3136173A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170301&DB=EPODOC&CC=EP&NR=3136173A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHINDO, Hiroaki</creatorcontrib><title>RADIATION-SENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE</title><description>There are provided a radiation-sensitive resin composition comprising a binder resin (A), radiation-sensitive compound (B), and cross-linking agent (C) represented by the following general formula (1), whereina content of the cross-linking agent (C) is 3 to 25 parts by weight with respect to 100 parts by weight of the binder resin (A):
wherein, in the general formula (1), each of R 1 to R 3 independently represents a hydrocarbon group having 1 to 10 carbon atoms.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTROGRAPHY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAIcnTxdAzx9PfTDXb1C_YM8QxzVQhyDfb0U3D29w3wB4n4--lAhdw8fXx1FBz9XBRcfVydQ4L8_TydFVxcwzydXXkYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSbxrgLGhsZmhubGjoTERSgC5ryxq</recordid><startdate>20170301</startdate><enddate>20170301</enddate><creator>SHINDO, Hiroaki</creator><scope>EVB</scope></search><sort><creationdate>20170301</creationdate><title>RADIATION-SENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE</title><author>SHINDO, Hiroaki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3136173A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2017</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTROGRAPHY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>SHINDO, Hiroaki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHINDO, Hiroaki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RADIATION-SENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE</title><date>2017-03-01</date><risdate>2017</risdate><abstract>There are provided a radiation-sensitive resin composition comprising a binder resin (A), radiation-sensitive compound (B), and cross-linking agent (C) represented by the following general formula (1), whereina content of the cross-linking agent (C) is 3 to 25 parts by weight with respect to 100 parts by weight of the binder resin (A):
wherein, in the general formula (1), each of R 1 to R 3 independently represents a hydrocarbon group having 1 to 10 carbon atoms.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| source | esp@cenet |
| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTROGRAPHY GENERAL PROCESSES OF COMPOUNDING HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | RADIATION-SENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T19%3A13%3A38IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHINDO,%20Hiroaki&rft.date=2017-03-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3136173A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |