METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF IMIDAZOLE AND BISEPOXIDE COMPOUNDS

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF IMIDAZOLE AND BISEPOXIDE COMPOUNDS

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features in...

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Bibliographische Detailangaben
Hauptverfasser: WOERTINK, Julia, NIAZIMBETOVA, Zuhra, DZIEWISZEK, Joanna, REDDINGTON, Erik, THORSETH, Matthew, QIN, Yi, LEFEBVRE, Mark
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Zusammenfassung:Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.