PACKAGING FOR ELECTRONICS IN DOWNHOLE ASSEMBLIES

A downhole device configured to be inserted into a borehole includes a device body having an outer surface and a recess formed in the outer surface, a cover covering the recess to form a first cavity, and a shock-absorber configured to support an electrical module within the first cavity, the shock-...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WANG, Weiqiang, BURROUGHS, Edward Glenn, DREYER, Bernd, HUBER, Cord, REINERTSEN, Robert
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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