RF CIRCUIT WITH MULTI-LAYER RF SUBSTRATE INCLUDING AN ELECTROCONDUCTIVE GROUND PLANE WITH A VOID UNDER A BIAS LINE
An RF circuit includes a first dielectric material, a signal line and a bias line over a first surface of the first dielectric material, a conductive layer over a second surface of the first dielectric material, and a second dielectric material over the conductive layer. The first and second dielect...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Barbieri, Travis Noori, Basim |
| description | An RF circuit includes a first dielectric material, a signal line and a bias line over a first surface of the first dielectric material, a conductive layer over a second surface of the first dielectric material, and a second dielectric material over the conductive layer. The first and second dielectric materials have different dielectric constants. The conductive layer includes a ground plane over which the signal line is formed. A conductive material void, with which a section of the bias line is aligned, is present in the conductive layer. The RF circuit further includes a mounting area for an RF device. First ends of the signal line and the section of the bias line are located proximate to the mounting area to enable the signal line and the bias line to be electrically coupled with one or more leads of the RF device. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3109898A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3109898A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3109898A13</originalsourceid><addsrcrecordid>eNqNjMEKgkAURd20iOof3g8IiRtdPmee-mCakfGN0UokplWUZP9PQn1AqwP3XM42efkaFHsVWODM0sIpGOHU4IU8rK4PVS8ehYCtMkGzbQAtkCEl3ilndVDCA0HjXbAaOoOWviWEwbGGdV1TCBVjD4Yt7ZPNbbov8fDjLoGaRLVpnJ9jXObpGh_xPVKXZ8eyKAvM8j8uH8ZwN8A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RF CIRCUIT WITH MULTI-LAYER RF SUBSTRATE INCLUDING AN ELECTROCONDUCTIVE GROUND PLANE WITH A VOID UNDER A BIAS LINE</title><source>esp@cenet</source><creator>Barbieri, Travis ; Noori, Basim</creator><creatorcontrib>Barbieri, Travis ; Noori, Basim</creatorcontrib><description>An RF circuit includes a first dielectric material, a signal line and a bias line over a first surface of the first dielectric material, a conductive layer over a second surface of the first dielectric material, and a second dielectric material over the conductive layer. The first and second dielectric materials have different dielectric constants. The conductive layer includes a ground plane over which the signal line is formed. A conductive material void, with which a section of the bias line is aligned, is present in the conductive layer. The RF circuit further includes a mounting area for an RF device. First ends of the signal line and the section of the bias line are located proximate to the mounting area to enable the signal line and the bias line to be electrically coupled with one or more leads of the RF device.</description><language>eng ; fre ; ger</language><subject>AMPLIFIERS ; BASIC ELECTRIC ELEMENTS ; BASIC ELECTRONIC CIRCUITRY ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE ; SEMICONDUCTOR DEVICES ; WAVEGUIDES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161228&DB=EPODOC&CC=EP&NR=3109898A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161228&DB=EPODOC&CC=EP&NR=3109898A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Barbieri, Travis</creatorcontrib><creatorcontrib>Noori, Basim</creatorcontrib><title>RF CIRCUIT WITH MULTI-LAYER RF SUBSTRATE INCLUDING AN ELECTROCONDUCTIVE GROUND PLANE WITH A VOID UNDER A BIAS LINE</title><description>An RF circuit includes a first dielectric material, a signal line and a bias line over a first surface of the first dielectric material, a conductive layer over a second surface of the first dielectric material, and a second dielectric material over the conductive layer. The first and second dielectric materials have different dielectric constants. The conductive layer includes a ground plane over which the signal line is formed. A conductive material void, with which a section of the bias line is aligned, is present in the conductive layer. The RF circuit further includes a mounting area for an RF device. First ends of the signal line and the section of the bias line are located proximate to the mounting area to enable the signal line and the bias line to be electrically coupled with one or more leads of the RF device.</description><subject>AMPLIFIERS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WAVEGUIDES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjMEKgkAURd20iOof3g8IiRtdPmee-mCakfGN0UokplWUZP9PQn1AqwP3XM42efkaFHsVWODM0sIpGOHU4IU8rK4PVS8ehYCtMkGzbQAtkCEl3ilndVDCA0HjXbAaOoOWviWEwbGGdV1TCBVjD4Yt7ZPNbbov8fDjLoGaRLVpnJ9jXObpGh_xPVKXZ8eyKAvM8j8uH8ZwN8A</recordid><startdate>20161228</startdate><enddate>20161228</enddate><creator>Barbieri, Travis</creator><creator>Noori, Basim</creator><scope>EVB</scope></search><sort><creationdate>20161228</creationdate><title>RF CIRCUIT WITH MULTI-LAYER RF SUBSTRATE INCLUDING AN ELECTROCONDUCTIVE GROUND PLANE WITH A VOID UNDER A BIAS LINE</title><author>Barbieri, Travis ; Noori, Basim</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3109898A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2016</creationdate><topic>AMPLIFIERS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WAVEGUIDES</topic><toplevel>online_resources</toplevel><creatorcontrib>Barbieri, Travis</creatorcontrib><creatorcontrib>Noori, Basim</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Barbieri, Travis</au><au>Noori, Basim</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RF CIRCUIT WITH MULTI-LAYER RF SUBSTRATE INCLUDING AN ELECTROCONDUCTIVE GROUND PLANE WITH A VOID UNDER A BIAS LINE</title><date>2016-12-28</date><risdate>2016</risdate><abstract>An RF circuit includes a first dielectric material, a signal line and a bias line over a first surface of the first dielectric material, a conductive layer over a second surface of the first dielectric material, and a second dielectric material over the conductive layer. The first and second dielectric materials have different dielectric constants. The conductive layer includes a ground plane over which the signal line is formed. A conductive material void, with which a section of the bias line is aligned, is present in the conductive layer. The RF circuit further includes a mounting area for an RF device. First ends of the signal line and the section of the bias line are located proximate to the mounting area to enable the signal line and the bias line to be electrically coupled with one or more leads of the RF device.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP3109898A1 |
| source | esp@cenet |
| subjects | AMPLIFIERS BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SEMICONDUCTOR DEVICES WAVEGUIDES |
| title | RF CIRCUIT WITH MULTI-LAYER RF SUBSTRATE INCLUDING AN ELECTROCONDUCTIVE GROUND PLANE WITH A VOID UNDER A BIAS LINE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T22%3A23%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Barbieri,%20Travis&rft.date=2016-12-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3109898A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |