METHOD FOR PRODUCING A CIRCUIT BOARD
Removal of the temporary protective layer.
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | LANGER, Gregor DAMEJ, Mario LUTSCHOUNIG, Ferdinand |
description | Removal of the temporary protective layer. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3100310B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3100310B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3100310B13</originalsourceid><addsrcrecordid>eNrjZFDxdQ3x8HdRcPMPUggI8ncJdfb0c1dwVHD2DHIO9QxRcPJ3DHLhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgHGhgYGQOxkaEyEEgAdkiI0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR PRODUCING A CIRCUIT BOARD</title><source>esp@cenet</source><creator>LANGER, Gregor ; DAMEJ, Mario ; LUTSCHOUNIG, Ferdinand</creator><creatorcontrib>LANGER, Gregor ; DAMEJ, Mario ; LUTSCHOUNIG, Ferdinand</creatorcontrib><description>Removal of the temporary protective layer.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210707&DB=EPODOC&CC=EP&NR=3100310B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210707&DB=EPODOC&CC=EP&NR=3100310B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LANGER, Gregor</creatorcontrib><creatorcontrib>DAMEJ, Mario</creatorcontrib><creatorcontrib>LUTSCHOUNIG, Ferdinand</creatorcontrib><title>METHOD FOR PRODUCING A CIRCUIT BOARD</title><description>Removal of the temporary protective layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDxdQ3x8HdRcPMPUggI8ncJdfb0c1dwVHD2DHIO9QxRcPJ3DHLhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgHGhgYGQOxkaEyEEgAdkiI0</recordid><startdate>20210707</startdate><enddate>20210707</enddate><creator>LANGER, Gregor</creator><creator>DAMEJ, Mario</creator><creator>LUTSCHOUNIG, Ferdinand</creator><scope>EVB</scope></search><sort><creationdate>20210707</creationdate><title>METHOD FOR PRODUCING A CIRCUIT BOARD</title><author>LANGER, Gregor ; DAMEJ, Mario ; LUTSCHOUNIG, Ferdinand</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3100310B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LANGER, Gregor</creatorcontrib><creatorcontrib>DAMEJ, Mario</creatorcontrib><creatorcontrib>LUTSCHOUNIG, Ferdinand</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LANGER, Gregor</au><au>DAMEJ, Mario</au><au>LUTSCHOUNIG, Ferdinand</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR PRODUCING A CIRCUIT BOARD</title><date>2021-07-07</date><risdate>2021</risdate><abstract>Removal of the temporary protective layer.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng ; fre ; ger |
recordid | cdi_epo_espacenet_EP3100310B1 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
title | METHOD FOR PRODUCING A CIRCUIT BOARD |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T04%3A30%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LANGER,%20Gregor&rft.date=2021-07-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3100310B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |