METHOD FOR PRODUCING A CIRCUIT BOARD

Removal of the temporary protective layer.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LANGER, Gregor, DAMEJ, Mario, LUTSCHOUNIG, Ferdinand
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator LANGER, Gregor
DAMEJ, Mario
LUTSCHOUNIG, Ferdinand
description Removal of the temporary protective layer.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3100310B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3100310B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3100310B13</originalsourceid><addsrcrecordid>eNrjZFDxdQ3x8HdRcPMPUggI8ncJdfb0c1dwVHD2DHIO9QxRcPJ3DHLhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgHGhgYGQOxkaEyEEgAdkiI0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR PRODUCING A CIRCUIT BOARD</title><source>esp@cenet</source><creator>LANGER, Gregor ; DAMEJ, Mario ; LUTSCHOUNIG, Ferdinand</creator><creatorcontrib>LANGER, Gregor ; DAMEJ, Mario ; LUTSCHOUNIG, Ferdinand</creatorcontrib><description>Removal of the temporary protective layer.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210707&amp;DB=EPODOC&amp;CC=EP&amp;NR=3100310B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210707&amp;DB=EPODOC&amp;CC=EP&amp;NR=3100310B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LANGER, Gregor</creatorcontrib><creatorcontrib>DAMEJ, Mario</creatorcontrib><creatorcontrib>LUTSCHOUNIG, Ferdinand</creatorcontrib><title>METHOD FOR PRODUCING A CIRCUIT BOARD</title><description>Removal of the temporary protective layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDxdQ3x8HdRcPMPUggI8ncJdfb0c1dwVHD2DHIO9QxRcPJ3DHLhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgHGhgYGQOxkaEyEEgAdkiI0</recordid><startdate>20210707</startdate><enddate>20210707</enddate><creator>LANGER, Gregor</creator><creator>DAMEJ, Mario</creator><creator>LUTSCHOUNIG, Ferdinand</creator><scope>EVB</scope></search><sort><creationdate>20210707</creationdate><title>METHOD FOR PRODUCING A CIRCUIT BOARD</title><author>LANGER, Gregor ; DAMEJ, Mario ; LUTSCHOUNIG, Ferdinand</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3100310B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LANGER, Gregor</creatorcontrib><creatorcontrib>DAMEJ, Mario</creatorcontrib><creatorcontrib>LUTSCHOUNIG, Ferdinand</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LANGER, Gregor</au><au>DAMEJ, Mario</au><au>LUTSCHOUNIG, Ferdinand</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR PRODUCING A CIRCUIT BOARD</title><date>2021-07-07</date><risdate>2021</risdate><abstract>Removal of the temporary protective layer.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP3100310B1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title METHOD FOR PRODUCING A CIRCUIT BOARD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T04%3A30%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LANGER,%20Gregor&rft.date=2021-07-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3100310B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true