PACKAGE ASSEMBLY

A package assembly (1, 1a, 1b) includes a housing frame (2, 2a), a power module (3), a first heat dissipating module (4) and a second heat dissipating module (5. 5a). The housing frame (2, 2a) is fixed on the first heat dissipating module (4). The power module (3) is disposed within a hollow part (2...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chen, Da-Jung, Tan, Chad-Yao
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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