PACKAGE ASSEMBLY
A package assembly (1, 1a, 1b) includes a housing frame (2, 2a), a power module (3), a first heat dissipating module (4) and a second heat dissipating module (5. 5a). The housing frame (2, 2a) is fixed on the first heat dissipating module (4). The power module (3) is disposed within a hollow part (2...
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| creator | Chen, Da-Jung Tan, Chad-Yao |
| description | A package assembly (1, 1a, 1b) includes a housing frame (2, 2a), a power module (3), a first heat dissipating module (4) and a second heat dissipating module (5. 5a). The housing frame (2, 2a) is fixed on the first heat dissipating module (4). The power module (3) is disposed within a hollow part (22) of the housing frame (2, 2a), and covers a first open end (23) of the hollow part (22). The power module (3) includes a first surface (31), a second surface (32) and at least one pin (33). The first surface (31) has a periphery region (31a) and a middle region (31b). The second surface (32) is attached on the first heat dissipating module (4). The at least one pin (33) is disposed on the periphery region (31a). The at least one pin (33) is penetrated through the corresponding opening (25) and partially exposed outside the housing frame (2, 2a). The second heat dissipating module (5, 5a) is disposed within the hollow part (22) and attached on the middle region (31b) of the first surface (31) of the power module (3). |
| format | Patent |
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The power module (3) is disposed within a hollow part (22) of the housing frame (2, 2a), and covers a first open end (23) of the hollow part (22). The power module (3) includes a first surface (31), a second surface (32) and at least one pin (33). The first surface (31) has a periphery region (31a) and a middle region (31b). The second surface (32) is attached on the first heat dissipating module (4). The at least one pin (33) is disposed on the periphery region (31a). The at least one pin (33) is penetrated through the corresponding opening (25) and partially exposed outside the housing frame (2, 2a). The second heat dissipating module (5, 5a) is disposed within the hollow part (22) and attached on the middle region (31b) of the first surface (31) of the power module (3).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191106&DB=EPODOC&CC=EP&NR=3098845B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191106&DB=EPODOC&CC=EP&NR=3098845B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Chen, Da-Jung</creatorcontrib><creatorcontrib>Tan, Chad-Yao</creatorcontrib><title>PACKAGE ASSEMBLY</title><description>A package assembly (1, 1a, 1b) includes a housing frame (2, 2a), a power module (3), a first heat dissipating module (4) and a second heat dissipating module (5. 5a). The housing frame (2, 2a) is fixed on the first heat dissipating module (4). The power module (3) is disposed within a hollow part (22) of the housing frame (2, 2a), and covers a first open end (23) of the hollow part (22). The power module (3) includes a first surface (31), a second surface (32) and at least one pin (33). The first surface (31) has a periphery region (31a) and a middle region (31b). The second surface (32) is attached on the first heat dissipating module (4). The at least one pin (33) is disposed on the periphery region (31a). The at least one pin (33) is penetrated through the corresponding opening (25) and partially exposed outside the housing frame (2, 2a). The second heat dissipating module (5, 5a) is disposed within the hollow part (22) and attached on the middle region (31b) of the first surface (31) of the power module (3).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAIcHT2dnR3VXAMDnb1dfKJ5GFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxgaWFhYmpk6GxkQoAQDDCR0X</recordid><startdate>20191106</startdate><enddate>20191106</enddate><creator>Chen, Da-Jung</creator><creator>Tan, Chad-Yao</creator><scope>EVB</scope></search><sort><creationdate>20191106</creationdate><title>PACKAGE ASSEMBLY</title><author>Chen, Da-Jung ; Tan, Chad-Yao</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3098845B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Chen, Da-Jung</creatorcontrib><creatorcontrib>Tan, Chad-Yao</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chen, Da-Jung</au><au>Tan, Chad-Yao</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PACKAGE ASSEMBLY</title><date>2019-11-06</date><risdate>2019</risdate><abstract>A package assembly (1, 1a, 1b) includes a housing frame (2, 2a), a power module (3), a first heat dissipating module (4) and a second heat dissipating module (5. 5a). The housing frame (2, 2a) is fixed on the first heat dissipating module (4). The power module (3) is disposed within a hollow part (22) of the housing frame (2, 2a), and covers a first open end (23) of the hollow part (22). The power module (3) includes a first surface (31), a second surface (32) and at least one pin (33). The first surface (31) has a periphery region (31a) and a middle region (31b). The second surface (32) is attached on the first heat dissipating module (4). The at least one pin (33) is disposed on the periphery region (31a). The at least one pin (33) is penetrated through the corresponding opening (25) and partially exposed outside the housing frame (2, 2a). The second heat dissipating module (5, 5a) is disposed within the hollow part (22) and attached on the middle region (31b) of the first surface (31) of the power module (3).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | PACKAGE ASSEMBLY |
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