ENCAPSULATED SEMICONDUCTOR DEVICE AND ENCAPSULATION METHOD

The present invention relates to an encapsulated semiconductor device (20) provided on a flexible substrate (1), a method of providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1) and a software product for providing an at least partially encapsulated semi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MEYER, Jens, GRABOWSKI, Stefan Peter, HARTMAN, Sören, GIERTH, Rainald Manfred, VAN DE WEIJER, Peter, BOUTEN, Petrus Cornelis Paulus, LIFKA, Herbert, VAN ELSBERGEN, Volker Lambert, RUSKE, Manfred Stephan
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ELECTRICITY
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