CARRIER-BONDING METHODS AND ARTICLES FOR SEMICONDUCTOR AND INTERPOSER PROCESSING

A thin sheet (20) disposed on a carrier (10) via a surface modification layer (30) to form an article (2), wherein the article may be subjected to high temperature processing, as in FEOL semiconductor processing, not outgas and have the thin sheet maintained on the carrier without separation therefr...

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Hauptverfasser:	KEECH, John Tyler, SHOREY, Aric Bruce, ENICKS, Darwin Gene, THOMAS, Windsor Pipes, III
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	KEECH, John Tyler SHOREY, Aric Bruce ENICKS, Darwin Gene THOMAS, Windsor Pipes, III
description	A thin sheet (20) disposed on a carrier (10) via a surface modification layer (30) to form an article (2), wherein the article may be subjected to high temperature processing, as in FEOL semiconductor processing, not outgas and have the thin sheet maintained on the carrier without separation therefrom during the processing, yet be separated therefrom upon room temperature peeling force that leaves the thinner one of the thin sheet and carrier intact. Interposers (56) having arrays (50) of vias (60) may be formed on the thin sheet, and devices (66) formed on the interposers. Alternatively, the thin sheet may be a substrate on which semiconductor circuits are formed during FEOL processing.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	CARRIER-BONDING METHODS AND ARTICLES FOR SEMICONDUCTOR AND INTERPOSER PROCESSING
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