ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES

The electronic package includes a substrate and an electronic component mounted to a surface of the substrate. An interposer is mounted to the surface of the substrate such that the interposer surrounds the electronic component and is electrically connected to the substrate. An over-mold covers the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RAGHAVAN, Prasanna, FEI, Huiyang
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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