ELECTROLYTIC COPPER PLATING SOLUTION

ELECTROLYTIC COPPER PLATING SOLUTION

An electrolytic copper plating solution is disclosed which can form a rectangular circuit pattern. A method for conducting electrolytic plating on a board by using the electrolytic copper plating solution and an electrolytic circuit which is formed by using the electrolytic copper plating solution i...

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Hauptverfasser: SAITO, Mutsuko, MIZUNO, Yoko, SAKAI, Makoto, MORINAGA, Toshiyuki, HAYASHI, Shinjiro
Format: Patent
Sprache:eng ; fre ; ger
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator SAITO, Mutsuko
MIZUNO, Yoko
SAKAI, Makoto
MORINAGA, Toshiyuki
HAYASHI, Shinjiro
description An electrolytic copper plating solution is disclosed which can form a rectangular circuit pattern. A method for conducting electrolytic plating on a board by using the electrolytic copper plating solution and an electrolytic circuit which is formed by using the electrolytic copper plating solution is also described. The electrolytic copper plating solution contains two kinds of specific surfactants.
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title ELECTROLYTIC COPPER PLATING SOLUTION
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