METHOD AND STRUCTURE TO CONTACT TIGHT PITCH CONDUCTIVE LAYERS WITH GUIDED VIAS

An apparatus including a circuit substrate; a first interconnect layer in a first plane on the substrate and a second interconnect layer in a different second plane on the substrate; and a hardmask layer separating the first interconnect layer and the second interconnect layer, wherein the hardmask...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAN, Elliot N, SCHENKER, Richard E
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!