EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

An epoxy resin composition, comprising an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a carboxylic acid compound that satisfies at least one selected from the group consisting of the following A, B and C below: A: having at least one carboxy group and at least one hyd...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ONO, Yuta, KOBAYASHI, Hironori, KITAGAWA, Yuya, HASEGAWA, Teruyoshi, FUSUMADA, Mitsuaki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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