MANUFACTURING METHOD FOR BACK DRILLING HOLE IN PCB AND PCB

MANUFACTURING METHOD FOR BACK DRILLING HOLE IN PCB AND PCB

A method for manufacturing a back drilling hole in a printed circuit board (PCB) and PCB are provided. The method for manufacturing the back drilling hole comprises: forming a through hole in the PCB (1); forming a metal layer (12) with prescribed thickness on an inner wall of the through hole; fill...

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Hauptverfasser: CHEN, Xianren, REN, Baowei
Format: Patent
Sprache:eng ; fre ; ger
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator CHEN, Xianren
REN, Baowei
description A method for manufacturing a back drilling hole in a printed circuit board (PCB) and PCB are provided. The method for manufacturing the back drilling hole comprises: forming a through hole in the PCB (1); forming a metal layer (12) with prescribed thickness on an inner wall of the through hole; filling resin in the through hole which has been formed with the metal layer (12); performing back drilling machining on the through hole which has been filled with the resin; removing metal scraps remained in the through hole. The manufacturing method protects the hole wall copper by filling the hole with the resin, so that acid corrosion process only removes the remained metal scraps after back drilling of the small hole, does not affect on the hole copper of the resin protecting portion, and the manufacturing process is simple.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3030062B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3030062B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3030062B13</originalsourceid><addsrcrecordid>eNrjZLDydfQLdXN0DgkN8vRzV_B1DfHwd1Fw8w9ScHJ09lZwCfL08QFJePj7uCp4-ikEODspOPq5gGgeBta0xJziVF4ozc2g4OYa4uyhm1qQH59aXJCYnJqXWhLvGmBsYGxgYGbkZGhMhBIAKJwn5Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MANUFACTURING METHOD FOR BACK DRILLING HOLE IN PCB AND PCB</title><source>esp@cenet</source><creator>CHEN, Xianren ; REN, Baowei</creator><creatorcontrib>CHEN, Xianren ; REN, Baowei</creatorcontrib><description>A method for manufacturing a back drilling hole in a printed circuit board (PCB) and PCB are provided. The method for manufacturing the back drilling hole comprises: forming a through hole in the PCB (1); forming a metal layer (12) with prescribed thickness on an inner wall of the through hole; filling resin in the through hole which has been formed with the metal layer (12); performing back drilling machining on the through hole which has been filled with the resin; removing metal scraps remained in the through hole. The manufacturing method protects the hole wall copper by filling the hole with the resin, so that acid corrosion process only removes the remained metal scraps after back drilling of the small hole, does not affect on the hole copper of the resin protecting portion, and the manufacturing process is simple.</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180103&amp;DB=EPODOC&amp;CC=EP&amp;NR=3030062B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180103&amp;DB=EPODOC&amp;CC=EP&amp;NR=3030062B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN, Xianren</creatorcontrib><creatorcontrib>REN, Baowei</creatorcontrib><title>MANUFACTURING METHOD FOR BACK DRILLING HOLE IN PCB AND PCB</title><description>A method for manufacturing a back drilling hole in a printed circuit board (PCB) and PCB are provided. The method for manufacturing the back drilling hole comprises: forming a through hole in the PCB (1); forming a metal layer (12) with prescribed thickness on an inner wall of the through hole; filling resin in the through hole which has been formed with the metal layer (12); performing back drilling machining on the through hole which has been filled with the resin; removing metal scraps remained in the through hole. The manufacturing method protects the hole wall copper by filling the hole with the resin, so that acid corrosion process only removes the remained metal scraps after back drilling of the small hole, does not affect on the hole copper of the resin protecting portion, and the manufacturing process is simple.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDydfQLdXN0DgkN8vRzV_B1DfHwd1Fw8w9ScHJ09lZwCfL08QFJePj7uCp4-ikEODspOPq5gGgeBta0xJziVF4ozc2g4OYa4uyhm1qQH59aXJCYnJqXWhLvGmBsYGxgYGbkZGhMhBIAKJwn5Q</recordid><startdate>20180103</startdate><enddate>20180103</enddate><creator>CHEN, Xianren</creator><creator>REN, Baowei</creator><scope>EVB</scope></search><sort><creationdate>20180103</creationdate><title>MANUFACTURING METHOD FOR BACK DRILLING HOLE IN PCB AND PCB</title><author>CHEN, Xianren ; REN, Baowei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3030062B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN, Xianren</creatorcontrib><creatorcontrib>REN, Baowei</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN, Xianren</au><au>REN, Baowei</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURING METHOD FOR BACK DRILLING HOLE IN PCB AND PCB</title><date>2018-01-03</date><risdate>2018</risdate><abstract>A method for manufacturing a back drilling hole in a printed circuit board (PCB) and PCB are provided. The method for manufacturing the back drilling hole comprises: forming a through hole in the PCB (1); forming a metal layer (12) with prescribed thickness on an inner wall of the through hole; filling resin in the through hole which has been formed with the metal layer (12); performing back drilling machining on the through hole which has been filled with the resin; removing metal scraps remained in the through hole. The manufacturing method protects the hole wall copper by filling the hole with the resin, so that acid corrosion process only removes the remained metal scraps after back drilling of the small hole, does not affect on the hole copper of the resin protecting portion, and the manufacturing process is simple.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title MANUFACTURING METHOD FOR BACK DRILLING HOLE IN PCB AND PCB
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T01%3A00%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHEN,%20Xianren&rft.date=2018-01-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3030062B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true