INTEGRATING MULTI-OUTPUT POWER CONVERTERS HAVING VERTICALLY STACKED SEMICONDUCTOR CHIPS

A electronic multi-output device having a substrate including a pad and pins. A composite first chip has a first and a second transistor integrated so that the first terminals of the transistors are merged into a common terminal on one chip surface. Patterned second and third terminals are on the op...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DENISON, MARIE, CARPENTER, BRIAN, ASHLEY, LOPEZ, OSVALDO, JORGE, HERBSOMMER, JUAN, ALEJANDRO, NOQUIL, JONATHAN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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